公开(公告)号：US20190161572A1

公开(公告)日：2019-05-30

申请号：US16178121

申请日：2018-11-01

申请人： Hyundai Motor Company ,  Kia Motors Corporation

发明人： Joon Yong Song ,  Shin Tae Bae ,  KieYoun Jeong ,  Soon Young Cha ,  Hong Won Chae ,  Hyeon Cheol Kim

IPC分类号： C08G2/10 ,  C08K5/3445 ,  C08K5/24 ,  C08K7/14 ,  C08K3/40 ,  C08K13/02

CPC分类号： C08G2/10 ,  C08K3/40 ,  C08K5/16 ,  C08K5/24 ,  C08K5/3445 ,  C08K5/34922 ,  C08K7/06 ,  C08K7/14 ,  C08K13/02 ,  C08K2201/004 ,  C08L59/02

摘要： Disclosed is a polyoxymethylene resin composition that includes a filler in an amount of about 5 to 30 wt %, a formaldehyde reducing agent in an amount of about 0.01 to 1 wt %, and a polyoxymethylene resin constituting the remaining balance of the polyoxymethylene resin composition, all the wt % based on the total weight of the polyoxymethylene resin composition. In particular, per 1 g of the polyoxymethylene resin may include an amount of 30 to 40 μmol of formate at terminal ends of the polyoxymethylene resin.

公开(公告)号：US10808067B2

公开(公告)日：2020-10-20

申请号：US16178121

申请日：2018-11-01

申请人： Hyundai Motor Company ,  Kia Motors Corporation

发明人： Joon Yong Song ,  Shin Tae Bae ,  KieYoun Jeong ,  Soon Young Cha ,  Hong Won Chae ,  Hyeon Cheol Kim

IPC分类号： C08G2/10 ,  C08K3/40 ,  C08K13/02 ,  C08K7/14 ,  C08K5/16 ,  C08K7/06 ,  C08K5/3445 ,  C08K5/24 ,  C08K5/3492

摘要： Disclosed is a polyoxymethylene resin composition that includes a filler in an amount of about 5 to 30 wt %, a formaldehyde reducing agent in an amount of about 0.01 to 1 wt %, and a polyoxymethylene resin constituting the remaining balance of the polyoxymethylene resin composition, all the wt % based on the total weight of the polyoxymethylene resin composition. In particular, per 1 g of the polyoxymethylene resin may include an amount of 30 to 40 μmol of formate at terminal ends of the polyoxymethylene resin.

公开(公告)号：US09803059B2

公开(公告)日：2017-10-31

申请号：US14555982

申请日：2014-11-28

申请人： HYUNDAI MOTOR COMPANY ,  KIA MOTORS CORPORATION ,  LOTTE CHEMICAL CORPORATION

发明人： Hak Soo Kim ,  Dae Sik Kim ,  KieYoun Jeong ,  Young-Gyu You ,  Byung-kook Nam ,  Seong Min Cho

IPC分类号： C08J9/00 ,  C08L23/12 ,  C08L23/06 ,  C08J9/06 ,  B60H1/00

CPC分类号： C08J9/0061 ,  B60H1/00564 ,  B60H1/242 ,  C08J9/0066 ,  C08J9/06 ,  C08J2201/03 ,  C08J2323/12 ,  C08J2423/06 ,  C08J2423/12 ,  C08L23/10 ,  C08L2205/035 ,  C08L23/04 ,  C08L51/06 ,  C08K3/34

摘要： A polyolefin resin molded product includes a base which comprises at least one kind of polypropylene resin having a crystallization temperature of 112° C. to 150° C.; low density polyethylene; an inorganic filler; and an olefin polymer comprising 2 wt % to 10 wt % of a reactive functional group bonded to a main chain or an end thereof and having a diameter of 0.5 μm to 200 μm. The base has foam cells having an average diameter of 20 μm to 50 μm are distributed on thereon.