公开(公告)号：US20080290513A1

公开(公告)日：2008-11-27

申请号：US12125391

申请日：2008-05-22

申请人： Hyung-Jik BYUN ,  Jong-Gi LEE ,  Jong-Ho LEE ,  Se-Young YANG

发明人： Hyung-Jik BYUN ,  Jong-Gi LEE ,  Jong-Ho LEE ,  Se-Young YANG

IPC分类号： H01L23/488

CPC分类号： H01L23/49816 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Provided are a semiconductor package having molded balls on a bottom surface of a PCB and a method of manufacturing the semiconductor package. The semiconductor package includes: a semiconductor chip mounting member comprising circuit patterns on a first surface, an insulating layer defining openings exposing at least portions of the circuit patterns, and external contact terminals arranged on the portions of circuit patterns exposed by the openings; a semiconductor chip formed on a second surface of the semiconductor chip mounting member and electrically connected to the semiconductor chip mounting member; a first sealing portion coating the second surface of the semiconductor chip mounting member and the semiconductor chip; and a second sealing portion arranged on the insulating layer and the external contact terminals such that at least portions of the external contact terminals are exposed.

摘要翻译： 提供了一种在PCB的底表面上具有模制球的半导体封装以及半导体封装的制造方法。 所述半导体封装包括：半导体芯片安装构件，其包括在第一表面上的电路图案，绝缘层限定露出所述电路图案的至少一部分的开口以及布置在由所述开口暴露的所述电路图案部分上的外部接触端子; 半导体芯片，形成在所述半导体芯片安装构件的第二表面上并电连接到所述半导体芯片安装构件; 涂覆半导体芯片安装构件和半导体芯片的第二表面的第一密封部分; 以及布置在绝缘层和外部接触端子上的第二密封部分，使得外部接触端子的至少一部分露出。