公开(公告)号：US11748545B2

公开(公告)日：2023-09-05

申请号：US17458598

申请日：2021-08-27

申请人： I-SHOU UNIVERSITY

发明人： Yu-Jung Huang ,  Mong-Na Lo Huang ,  Tzu-Lun Yuan ,  Mei-Hui Guo

IPC分类号： G06F30/00 ,  G06F30/392 ,  H04B17/391 ,  H01L25/065

CPC分类号： G06F30/392 ,  H04B17/391 ,  H01L25/0657 ,  H01L2225/06531

摘要： A method and an electronic device for configuring signal pads between three-dimensional stacked chips are provided. The method includes: obtaining a plurality of frequency response curves corresponding to a plurality of parameter sets; obtaining an operating frequency; selecting a selected frequency response curve from the plurality of frequency response curves according to the operating frequency, where the selected frequency response curve corresponds to a selected parameter set among the plurality of parameter sets; generating, according to the selected parameter set, a signal pad configuration for configuring a first signal pad and a second signal pad on a surface of a chip; and outputting the signal pad configuration.

公开(公告)号：US20230038144A1

公开(公告)日：2023-02-09

申请号：US17458598

申请日：2021-08-27

申请人： I-SHOU UNIVERSITY

发明人： Yu-Jung Huang ,  Mong-Na Lo Huang ,  Tzu-Lun Yuan ,  Mei-Hui Guo

IPC分类号： G06F30/392 ,  H04B17/391

摘要： A method and an electronic device for configuring signal pads between three-dimensional stacked chips are provided. The method includes: obtaining a plurality of frequency response curves corresponding to a plurality of parameter sets; obtaining an operating frequency; selecting a selected frequency response curve from the plurality of frequency response curves according to the operating frequency, where the selected frequency response curve corresponds to a selected parameter set among the plurality of parameter sets; generating, according to the selected parameter set, a signal pad configuration for configuring a first signal pad and a second signal pad on a surface of a chip; and outputting the signal pad configuration.