公开(公告)号：US20250056718A1

公开(公告)日：2025-02-13

申请号：US18790375

申请日：2024-07-31

Applicant: IBIDEN CO., LTD.

Inventor： Atsushi ISHIDA

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K3/18

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer laminated on the first conductor layer, a second conductor layer formed on a surface of the resin insulating layer, and a via conductor formed in the resin insulating layer such that the via conductor is connecting the first conductor layer and the second conductor layer. The resin insulating layer includes resin and inorganic particles including first particles and second particles such that the first particles have flat exposed portions, the second particles are embedded in the resin, and the surface of the resin insulating layer includes the resin and the flat exposed portions of the first particles.

公开(公告)号：US20230309244A1

公开(公告)日：2023-09-28

申请号：US18188654

申请日：2023-03-23

Applicant: IBIDEN CO., LTD.

Inventor： Atsushi ISHIDA

IPC: H05K3/40 ,  H05K1/11 ,  H05K1/02 ,  H05K1/09 ,  H05K3/16 ,  H05K3/18

CPC classification number: H05K3/4038 ,  H05K1/115 ,  H05K1/0298 ,  H05K1/09 ,  H05K3/16 ,  H05K3/188 ,  H05K2203/095

Abstract: A method for manufacturing a printed wiring board includes forming a first conductor layer, forming an adhesive layer including a nitrogen-based organic compound and covering a surface of the first layer, forming a resin insulating layer covering the adhesive layer and having the second surface facing the first conductor layer, forming a protective film on the first surface of the insulating layer, forming an opening in the insulating layer such that the opening penetrates through the insulating layer and reaches the adhesive layer, applying plasma to the opening of the insulating layer such that the plasma cleans an inside of the opening, removing the protective film from the insulating layer after cleaning the inside of the opening, forming a second conductor layer on the first surface of the insulating layer, and forming a via conductor in the opening such that the via conductor connects the first layer and second layer.

公开(公告)号：US20220181064A1

公开(公告)日：2022-06-09

申请号：US17676558

申请日：2022-02-21

Applicant: IBIDEN CO., LTD.

Inventor： Hiroaki KODAMA ,  Atsushi ISHIDA ,  Kazuro NISHIWAKI

IPC: H01F27/24

Abstract: An inductor built-in substrate includes a core substrate having an opening and a first through hole, a first plating film formed in the first through hole of the core substrate, a magnetic resin body having a second through hole and including a magnetic resin filled in the opening of the core substrate, and a second plating film formed in the second through hole of the magnetic resin body such that the second plating film is formed in contact with the magnetic resin body.