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公开(公告)号：US11658534B2
公开(公告)日：2023-05-23
申请号：US17450856
申请日：2021-10-14
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
IPC: H02K3/26
CPC classification number: H02K3/26 , H02K2203/03
Abstract: A coil substrate includes a flexible substrate having first and second ends, a first coil formed on first surface of the substrate such that the first coil has center space and first wiring surrounding the space, and an second coil formed on second surface of the substrate such that the second coil has center space and second wiring surrounding the space and is positioned directly below the first coil. Each of the first and second wirings has outer and inner ends such that each wiring is formed in spiral shape between the outer and inner ends, a number of turns in the first coil is greater than a number of turns in the second coil, a width of the first wiring is substantially constant from the outer end to the inner end, and a width of the second wiring is not constant from the outer end to the inner end.
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公开(公告)号：US11264855B2
公开(公告)日：2022-03-01
申请号：US16685671
申请日：2019-11-15
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
Abstract: A coil substrate includes a flexible substrate, and a coil including a wiring and formed on the flexible substrate. The flexible substrate has a cut penetrating through the flexible substrate such that the cut is formed to extend along a portion of the coil.
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公开(公告)号：US11710996B2
公开(公告)日：2023-07-25
申请号：US17445750
申请日：2021-08-24
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
CPC classification number: H02K3/28 , H02K1/06 , H02K3/04 , H02K3/26 , H02K15/0407 , H05K1/118 , H01F5/003 , H02K2203/03 , H02K2211/03 , H05K2201/10265
Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate such that the coils are positioned substantially in a row between the first end and second end of the flexible substrate. The coils are formed such that the number of coils is K and that the coils include the first coil positioned close to the first end and the K-th coil positioned to form a predetermined distance between the K-th coil and the second end, where K is an integer equal to or greater than 2.
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公开(公告)号：US11557932B2
公开(公告)日：2023-01-17
申请号：US17407900
申请日：2021-08-20
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
IPC: H02K3/26
Abstract: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate in substantially one row between the first end and the second end of the flexible substrate such that each of the coils has a center space and wirings surrounding the center space. The wirings in each of the coils include parallel wirings formed substantially parallel to a row direction extending from the first end toward the second end and perpendicular wirings formed substantially perpendicular to the row direction, and the coils are formed such that a thickness of the perpendicular wirings is greater than a thickness of the parallel wirings.
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公开(公告)号：US10937588B2
公开(公告)日：2021-03-02
申请号：US16019591
申请日：2018-06-27
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Shinobu Kato , Hitoshi Miwa , Hisashi Kato , Toshihiko Yokomaku
Abstract: A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.
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Patent Agency Ranking
公开(公告)号：US20190115130A1
公开(公告)日：2019-04-18
申请号：US16161562
申请日：2018-10-16
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Shinobu Kato , Hitoshi Miwa , Hisashi Kato , Toshihiko Yokomaku
Abstract: A laminated coil substrate includes a printed wiring board including a resin substrate, a first conductor layer on first surface of the substrate and including coils, and a second conductor layer formed on second surface of the substrate on the opposite side and including coils. The printed wiring board includes first, second and third coil substrates that are folded such that the second surface of the substrate in the first and second coil substrates oppose each other and that the first surface of the substrate in the second and third coil substrates oppose each other, the second conductor layer of the printed wiring board includes connection wire on the second surface of the substrate and connecting the first and second coil substrates, and the first conductor layer of the printed wiring board includes connection wire on the first surface of the substrate and connecting the second and third coil substrates.
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公开(公告)号：US11588364B2
公开(公告)日：2023-02-21
申请号：US17004180
申请日：2020-08-27
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
Abstract: A motor coil substrate includes a coil substrate that is wound in a cylindrical shape and includes a flexible substrate and coils formed on the flexible substrate such that the flexible substrate has a first end and a second end on an opposite side with respect to the first end and that the coils are arrayed from the first end to the second end of the flexible substrate. The coils are formed such that each of the coils has a central space and includes wirings surrounding the central space, and the flexible substrate has openings formed such that each of the openings is penetrating through the flexible substrate and positioned in the central space of a respective one of the coils.
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公开(公告)号：US11695309B2
公开(公告)日：2023-07-04
申请号：US17386957
申请日：2021-07-28
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
IPC: H02K3/26
CPC classification number: H02K3/26 , H02K2203/03
Abstract: A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that the coils are positioned substantially in a raw and that each coil has a center space and wirings surrounding the center space. The coils are formed such that each coil includes first wirings on a first surface of the flexible substrate, second wirings on a second surface of the flexible substrate on the opposite side with respect to the first surface, and via conductors penetrating through the flexible substrate and connecting the first and second wirings, and the coils are positioned such that a m-th coil has the second wirings positioned below the center space of a (m+1)-th coil and that a (m+2)-th coil has the first coils positioned on the center space of a (m+1)-th coil, where in is an integer equal to or greater than 1.
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公开(公告)号：US10978926B2
公开(公告)日：2021-04-13
申请号：US16270642
申请日：2019-02-08
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Shinobu Kato , Hitoshi Miwa , Hisashi Kato , Toshihiko Yokomaku
Abstract: A motor coil substrate includes a flexible insulating substrate having a cylindrical shape, wirings formed on a first surface of the flexible insulating substrate and a second surface of the flexible insulating substrate on the opposite side with respect to the first surface, and via conductors including copper plating penetrating through the flexible insulating substrate such that the via conductors are connecting the wirings formed on the first surface and the wirings formed on the second surface. The wirings and the via conductors form coils formed in spiral shapes, and the flexible insulating substrate is wound more than one turn in a circumferential direction of the cylindrical shape such that the first surface on an inner side of the cylindrical shape and the second surface on an outer side of the cylindrical shape oppose each other.
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公开(公告)号：US10886048B2
公开(公告)日：2021-01-05
申请号：US16161562
申请日：2018-10-16
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Shinobu Kato , Hitoshi Miwa , Hisashi Kato , Toshihiko Yokomaku
Abstract: A laminated coil substrate includes a printed wiring board including a resin substrate, a first conductor layer on first surface of the substrate and including coils, and a second conductor layer formed on second surface of the substrate on the opposite side and including coils. The printed wiring board includes first, second and third coil substrates that are folded such that the second surface of the substrate in the first and second coil substrates oppose each other and that the first surface of the substrate in the second and third coil substrates oppose each other, the second conductor layer of the printed wiring board includes connection wire on the second surface of the substrate and connecting the first and second coil substrates, and the first conductor layer of the printed wiring board includes connection wire on the first surface of the substrate and connecting the second and third coil substrates.
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