-
公开(公告)号：US11658534B2
公开(公告)日：2023-05-23
申请号：US17450856
申请日：2021-10-14
申请人： IBIDEN CO., LTD.
发明人： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
IPC分类号： H02K3/26
CPC分类号： H02K3/26 , H02K2203/03
摘要： A coil substrate includes a flexible substrate having first and second ends, a first coil formed on first surface of the substrate such that the first coil has center space and first wiring surrounding the space, and an second coil formed on second surface of the substrate such that the second coil has center space and second wiring surrounding the space and is positioned directly below the first coil. Each of the first and second wirings has outer and inner ends such that each wiring is formed in spiral shape between the outer and inner ends, a number of turns in the first coil is greater than a number of turns in the second coil, a width of the first wiring is substantially constant from the outer end to the inner end, and a width of the second wiring is not constant from the outer end to the inner end.
-
公开(公告)号：US11264855B2
公开(公告)日：2022-03-01
申请号：US16685671
申请日：2019-11-15
申请人： IBIDEN CO., LTD.
发明人： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
摘要： A coil substrate includes a flexible substrate, and a coil including a wiring and formed on the flexible substrate. The flexible substrate has a cut penetrating through the flexible substrate such that the cut is formed to extend along a portion of the coil.
-
公开(公告)号：US20170352471A1
公开(公告)日：2017-12-07
申请号：US15614919
申请日：2017-06-06
申请人： IBIDEN CO., LTD.
发明人： Yasuhiko Mano , Hiroaki Kodama , Hisashi Kato
CPC分类号： H01F27/2828 , H01F17/0006 , H01F17/0013 , H01F17/0033 , H01F27/24 , H01F27/324 , H01F41/005 , H01F2017/002 , H01F2017/065 , H05K1/165 , H05K1/18 , H05K1/185 , H05K2201/1003 , H05K2203/1469
摘要： An inductor component includes a core base material, a magnetic body in the core, a first conductor pattern formed on primary surface of the core, a second conductor pattern formed on secondary surface of the core, and through-hole conductors formed in through holes through the core such that the conductors are connecting the first and second patterns. The first pattern, second pattern and conductors are positioned to form an inductor such that the magnetic body is positioned on inner side of the inductor, each conductor has a diameter k1, each pattern has conductor thickness in range of 50 μm to 200 μm and has line patterns each having width w1 and separated by line separation distance w2, and a ratio of cross-sectional area of each line pattern to cross-sectional area of each conductor along the diameter k1 in direction of the width w1 is in range of 0.8 to 2.0.
-
公开(公告)号：US11710996B2
公开(公告)日：2023-07-25
申请号：US17445750
申请日：2021-08-24
申请人： IBIDEN CO., LTD.
发明人： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
CPC分类号： H02K3/28 , H02K1/06 , H02K3/04 , H02K3/26 , H02K15/0407 , H05K1/118 , H01F5/003 , H02K2203/03 , H02K2211/03 , H05K2201/10265
摘要： A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate such that the coils are positioned substantially in a row between the first end and second end of the flexible substrate. The coils are formed such that the number of coils is K and that the coils include the first coil positioned close to the first end and the K-th coil positioned to form a predetermined distance between the K-th coil and the second end, where K is an integer equal to or greater than 2.
-
公开(公告)号：US11557932B2
公开(公告)日：2023-01-17
申请号：US17407900
申请日：2021-08-20
申请人： IBIDEN CO., LTD.
发明人： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
IPC分类号： H02K3/26
摘要： A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate in substantially one row between the first end and the second end of the flexible substrate such that each of the coils has a center space and wirings surrounding the center space. The wirings in each of the coils include parallel wirings formed substantially parallel to a row direction extending from the first end toward the second end and perpendicular wirings formed substantially perpendicular to the row direction, and the coils are formed such that a thickness of the perpendicular wirings is greater than a thickness of the parallel wirings.
-
公开(公告)号：US10937588B2
公开(公告)日：2021-03-02
申请号：US16019591
申请日：2018-06-27
申请人： IBIDEN CO., LTD.
摘要： A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.
-
公开(公告)号：US20190115130A1
公开(公告)日：2019-04-18
申请号：US16161562
申请日：2018-10-16
申请人： IBIDEN CO., LTD.
摘要： A laminated coil substrate includes a printed wiring board including a resin substrate, a first conductor layer on first surface of the substrate and including coils, and a second conductor layer formed on second surface of the substrate on the opposite side and including coils. The printed wiring board includes first, second and third coil substrates that are folded such that the second surface of the substrate in the first and second coil substrates oppose each other and that the first surface of the substrate in the second and third coil substrates oppose each other, the second conductor layer of the printed wiring board includes connection wire on the second surface of the substrate and connecting the first and second coil substrates, and the first conductor layer of the printed wiring board includes connection wire on the first surface of the substrate and connecting the second and third coil substrates.
-
公开(公告)号：US09232638B2
公开(公告)日：2016-01-05
申请号：US13975718
申请日：2013-08-26
申请人： IBIDEN CO., LTD.
发明人： Hisashi Kato , Ryojiro Tominaga , Tetsuya Nobutoki
CPC分类号： H05K1/0284 , H01L2924/0002 , H05K1/0271 , H05K3/4602 , H05K3/4644 , H05K3/4688 , H05K2201/0195 , H05K2201/029 , H05K2201/09136 , H05K2201/096 , Y10T156/10 , H01L2924/00
摘要： A printed wiring board includes a core substrate including resin and inorganic fiber, a first buildup layer formed on a first surface of the substrate and including resin insulating layers and first conductive layers, and a second buildup layer formed on a second surface of the substrate on the opposite side of the core substrate with respect to the first surface and including resin insulating layers and second conductive layers. The first conductive layers in the first buildup have sum V1 of volumes which is greater than sum V2 of volumes of the second conductive layers in the second buildup, and the substrate has a first-surface side portion which has resin amount greater than resin amount of a second-surface side portion of the substrate where boundary between the first-surface and second-surface side portions is set with respect to the center line in the thickness direction of the substrate.
摘要翻译： 印刷电路板包括：包括树脂和无机纤维的芯基板，形成在基板的第一表面上并包括树脂绝缘层和第一导电层的第一累积层，以及形成在基板的第二表面上的第二累积层， 芯基板相对于第一表面的相对侧，并且包括树脂绝缘层和第二导电层。 第一累积中的第一导电层的体积总和V1大于第二聚集体中的第二导电层的体积的和V2，并且基板具有树脂量大于树脂量的第一表面侧部分 基板的第二表面侧部分相对于基板的厚度方向上的中心线设定在第一表面和第二表面侧部分之间的边界。
-
公开(公告)号：US11588364B2
公开(公告)日：2023-02-21
申请号：US17004180
申请日：2020-08-27
申请人： IBIDEN CO., LTD.
发明人： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
摘要： A motor coil substrate includes a coil substrate that is wound in a cylindrical shape and includes a flexible substrate and coils formed on the flexible substrate such that the flexible substrate has a first end and a second end on an opposite side with respect to the first end and that the coils are arrayed from the first end to the second end of the flexible substrate. The coils are formed such that each of the coils has a central space and includes wirings surrounding the central space, and the flexible substrate has openings formed such that each of the openings is penetrating through the flexible substrate and positioned in the central space of a respective one of the coils.
-
公开(公告)号：US11695309B2
公开(公告)日：2023-07-04
申请号：US17386957
申请日：2021-07-28
申请人： IBIDEN CO., LTD.
发明人： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
IPC分类号： H02K3/26
CPC分类号： H02K3/26 , H02K2203/03
摘要： A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that the coils are positioned substantially in a raw and that each coil has a center space and wirings surrounding the center space. The coils are formed such that each coil includes first wirings on a first surface of the flexible substrate, second wirings on a second surface of the flexible substrate on the opposite side with respect to the first surface, and via conductors penetrating through the flexible substrate and connecting the first and second wirings, and the coils are positioned such that a m-th coil has the second wirings positioned below the center space of a (m+1)-th coil and that a (m+2)-th coil has the first coils positioned on the center space of a (m+1)-th coil, where in is an integer equal to or greater than 1.
-
-
-
-
-
-
-
-
-
搜索结果
22 条记录 (耗时 0.02 秒)
