Motor coil substrate and motor
    2.
    发明授权

    公开(公告)号:US11588364B2

    公开(公告)日:2023-02-21

    申请号:US17004180

    申请日:2020-08-27

    申请人: IBIDEN CO., LTD.

    IPC分类号: H02K3/28 H02K3/26

    摘要: A motor coil substrate includes a coil substrate that is wound in a cylindrical shape and includes a flexible substrate and coils formed on the flexible substrate such that the flexible substrate has a first end and a second end on an opposite side with respect to the first end and that the coils are arrayed from the first end to the second end of the flexible substrate. The coils are formed such that each of the coils has a central space and includes wirings surrounding the central space, and the flexible substrate has openings formed such that each of the openings is penetrating through the flexible substrate and positioned in the central space of a respective one of the coils.

    Coil substrate and motor coil substrate

    公开(公告)号:US11557932B2

    公开(公告)日:2023-01-17

    申请号:US17407900

    申请日:2021-08-20

    申请人: IBIDEN CO., LTD.

    IPC分类号: H02K3/26

    摘要: A coil substrate includes a flexible substrate having a first end and a second end on the opposite side with respect to the first end, and coils formed on the flexible substrate in substantially one row between the first end and the second end of the flexible substrate such that each of the coils has a center space and wirings surrounding the center space. The wirings in each of the coils include parallel wirings formed substantially parallel to a row direction extending from the first end toward the second end and perpendicular wirings formed substantially perpendicular to the row direction, and the coils are formed such that a thickness of the perpendicular wirings is greater than a thickness of the parallel wirings.

    Coil
    4.
    发明授权
    Coil 有权

    公开(公告)号:US10937588B2

    公开(公告)日:2021-03-02

    申请号:US16019591

    申请日:2018-06-27

    申请人: IBIDEN CO., LTD.

    摘要: A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.

    LAMINATED COIL SUBSTRATE
    5.
    发明申请

    公开(公告)号:US20190115130A1

    公开(公告)日:2019-04-18

    申请号:US16161562

    申请日:2018-10-16

    申请人: IBIDEN CO., LTD.

    摘要: A laminated coil substrate includes a printed wiring board including a resin substrate, a first conductor layer on first surface of the substrate and including coils, and a second conductor layer formed on second surface of the substrate on the opposite side and including coils. The printed wiring board includes first, second and third coil substrates that are folded such that the second surface of the substrate in the first and second coil substrates oppose each other and that the first surface of the substrate in the second and third coil substrates oppose each other, the second conductor layer of the printed wiring board includes connection wire on the second surface of the substrate and connecting the first and second coil substrates, and the first conductor layer of the printed wiring board includes connection wire on the first surface of the substrate and connecting the second and third coil substrates.

    Motor coil
    8.
    发明授权

    公开(公告)号:US10756589B2

    公开(公告)日:2020-08-25

    申请号:US16124246

    申请日:2018-09-07

    申请人: IBIDEN CO., LTD.

    IPC分类号: H02K3/26 H01F5/00 H02K3/28

    摘要: A motor coil includes a magnet structure, and a laminated coil substrate formed on the magnet structure and including coil substrates and adhesive layers alternately laminated. The coil substrates are formed by folding a printed wiring board including a resin substrate, a first conductor layer formed on a first surface of the resin substrate and forming coils, and a second conductor layer formed on a second surface on the opposite side with respect to the first surface and forming coils, and the adhesive layers include an adhesive layer including a magnetic sheet.

    COIL
    9.
    发明申请
    COIL 审中-公开

    公开(公告)号:US20180374630A1

    公开(公告)日:2018-12-27

    申请号:US16019591

    申请日:2018-06-27

    申请人: IBIDEN CO., LTD.

    IPC分类号: H01F27/28 H01F17/00 H01F5/00

    摘要: A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.

    Motor coil substrate
    10.
    发明授权

    公开(公告)号:US10978926B2

    公开(公告)日:2021-04-13

    申请号:US16270642

    申请日:2019-02-08

    申请人: IBIDEN CO., LTD.

    摘要: A motor coil substrate includes a flexible insulating substrate having a cylindrical shape, wirings formed on a first surface of the flexible insulating substrate and a second surface of the flexible insulating substrate on the opposite side with respect to the first surface, and via conductors including copper plating penetrating through the flexible insulating substrate such that the via conductors are connecting the wirings formed on the first surface and the wirings formed on the second surface. The wirings and the via conductors form coils formed in spiral shapes, and the flexible insulating substrate is wound more than one turn in a circumferential direction of the cylindrical shape such that the first surface on an inner side of the cylindrical shape and the second surface on an outer side of the cylindrical shape oppose each other.