公开(公告)号：US11622446B2

公开(公告)日：2023-04-04

申请号：US17359805

申请日：2021-06-28

申请人： IBIDEN CO., LTD.

发明人： Isao Ohno ,  Tomoya Daizo ,  Yoji Sawada ,  Kazuhiko Kuranobu

IPC分类号： H05K1/11 ,  H05K1/09 ,  H01L23/00 ,  H01L23/498

摘要： A wiring substrate includes a resin insulating layer, a conductor pad formed on the resin insulating layer, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post connected to the conductor pad and protruding from the coating insulating layer such that a gap is formed between the metal post and the conductor pad at a peripheral edge of the metal post. The coating insulating layer is formed such that the coating insulating layer has an interposed portion formed in the gap between the metal post and the conductor pad at the peripheral edge of the metal post.

公开(公告)号：US12033927B2

公开(公告)日：2024-07-09

申请号：US17361522

申请日：2021-06-29

申请人： IBIDEN CO., LTD.

发明人： Isao Ohno ,  Tomoya Daizo ,  Yoji Sawada ,  Kazuhiko Kuranobu

IPC分类号： H01L21/48 ,  H01L23/498

CPC分类号： H01L23/49822 ,  H01L21/4857

摘要： A method for manufacturing a wiring substrate includes forming multiple conductor pads on an insulating layer such that the conductor pads include multiple first conductor pads and multiple second conductor pads, forming multiple protruding parts on surfaces of the first conductor pads of the conductor pads, respectively, forming a resin layer such that the resin layer covers the insulating layer and the conductor pads, exposing, from the resin layer, end portions of the protruding parts on the opposite side with respect to the insulating layer, forming, in the resin layer, multiple openings such that the openings expose surfaces of the second conductor pads of the conductor pads, respectively; and forming a coating film on the surfaces of the second conductor pads exposed in the openings.

公开(公告)号：US11935822B2

公开(公告)日：2024-03-19

申请号：US17359887

申请日：2021-06-28

申请人： IBIDEN CO., LTD.

发明人： Isao Ohno ,  Tomoya Daizo ,  Yoji Sawada ,  Kazuhiko Kuranobu

IPC分类号： H01L23/498 ,  H01L21/48 ,  H01L23/00

CPC分类号： H01L23/49838 ,  H01L21/4857 ,  H01L23/49822 ,  H01L24/10 ,  H01L24/12 ,  H01L24/13 ,  H01L24/14

摘要： A wiring substrate includes a resin insulating layer, a via conductor formed in the resin insulating layer such that the via conductor is penetrating through the resin insulating layer, a conductor pad formed on the resin insulating layer and connected to the via conductor, a coating insulating layer formed on the resin insulating layer such that the coating insulating layer is covering the conductor pad, and a metal post formed on the conductor pad and protruding from the coating insulating layer. The conductor pad is formed such that a central axis of the conductor pad is shifted in a predetermined direction with respect to a central axis of the via conductor, and the metal post is formed such that a central axis of the metal post is shifted in the predetermined direction with respect to the central axis of the conductor pad.