公开(公告)号：US11437290B2

公开(公告)日：2022-09-06

申请号：US16869945

申请日：2020-05-08

申请人： IBIDEN CO., LTD.

发明人： Yusuke Tanaka ,  Tomohiro Futatsugi ,  Yuichi Nakamura ,  Yoshiki Matsui ,  Keinosuke Ino ,  Tomohiro Fuwa ,  Seiji Izawa

IPC分类号： H01L23/28 ,  H01L23/13 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29

摘要： An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.

公开(公告)号：US11935801B2

公开(公告)日：2024-03-19

申请号：US17730623

申请日：2022-04-27

申请人： IBIDEN CO., LTD.

发明人： Yusuke Tanaka ,  Tomohiro Futatsugi ,  Yuichi Nakamura ,  Yoshiki Matsui ,  Keinosuke Ino ,  Tomohiro Fuwa ,  Seiji Izawa

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L23/13 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/291 ,  H01L23/3171 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838

摘要： An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.

公开(公告)号：US11160168B2

公开(公告)日：2021-10-26

申请号：US16871431

申请日：2020-05-11

申请人： IBIDEN CO., LTD.

发明人： Yusuke Tanaka ,  Tomohiro Futatsugi ,  Yuichi Nakamura ,  Yoshiki Matsui

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/28 ,  H05K3/46 ,  H05K3/00

摘要： A wiring board for a built-in electronic component includes a first insulating layer, a second insulating layer formed under the first insulating layer, and a conductor layer formed on an upper surface of the second insulating layer such that a cavity is formed to penetrate through the first insulating layer and the conductor layer and expose the second insulating layer at a bottom of the cavity and is formed to accommodate an electronic component therein. The first insulating layer and the conductor layer are formed such that the cavity has a first inner side surface extending from an upper opening edge to a position closer to the second insulating layer, and a lateral expansion part formed between a lower edge of the first inner side surface and the second insulating layer and extending outward from the lower edge of the first inner side surface.