公开(公告)号：US11935801B2

公开(公告)日：2024-03-19

申请号：US17730623

申请日：2022-04-27

Applicant: IBIDEN CO., LTD.

Inventor： Yusuke Tanaka ,  Tomohiro Futatsugi ,  Yuichi Nakamura ,  Yoshiki Matsui ,  Keinosuke Ino ,  Tomohiro Fuwa ,  Seiji Izawa

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498

CPC classification number: H01L23/13 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/291 ,  H01L23/3171 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838

Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.

公开(公告)号：US11160168B2

公开(公告)日：2021-10-26

申请号：US16871431

申请日：2020-05-11

Applicant: IBIDEN CO., LTD.

Inventor： Yusuke Tanaka ,  Tomohiro Futatsugi ,  Yuichi Nakamura ,  Yoshiki Matsui

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/28 ,  H05K3/46 ,  H05K3/00

Abstract: A wiring board for a built-in electronic component includes a first insulating layer, a second insulating layer formed under the first insulating layer, and a conductor layer formed on an upper surface of the second insulating layer such that a cavity is formed to penetrate through the first insulating layer and the conductor layer and expose the second insulating layer at a bottom of the cavity and is formed to accommodate an electronic component therein. The first insulating layer and the conductor layer are formed such that the cavity has a first inner side surface extending from an upper opening edge to a position closer to the second insulating layer, and a lateral expansion part formed between a lower edge of the first inner side surface and the second insulating layer and extending outward from the lower edge of the first inner side surface.

公开(公告)号：US09391044B2

公开(公告)日：2016-07-12

申请号：US14446475

申请日：2014-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Keisuke Shimizu ,  Yuichi Nakamura ,  Tsuyoshi Yamaguchi

IPC: H05K1/09 ,  H01L23/00 ,  H05K1/18 ,  H05K3/46 ,  H05K3/00

CPC classification number: H01L24/83 ,  H01L2224/04105 ,  H01L2224/16235 ,  H01L2224/19 ,  H01L2224/27464 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/92244 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/187 ,  H05K3/0097 ,  H05K3/4682 ,  H05K2201/068 ,  H05K2203/0156 ,  H05K2203/1536 ,  Y10T29/302 ,  H01L2924/00 ,  H01L2224/83005

Abstract: A printed wiring board includes a first insulation layer, an electronic component built into the first insulation layer, a second insulation layer having a via conductor and formed on a first surface of the first insulation layer, and a conductive film formed on the first insulation layer on the opposite side with respect to the first surface of the first insulation layer such that the conductive film is positioned to face a back surface of the electronic component. The first insulation layer has a coefficient of thermal expansion which is set higher than a coefficient of thermal expansion of the second insulation layer.

Abstract translation: 印刷布线板包括第一绝缘层，内置在第一绝缘层中的电子部件，具有通孔导体并形成在第一绝缘层的第一表面上的第二绝缘层和形成在第一绝缘层上的导电膜 在相对于第一绝缘层的第一表面的相对侧上，使得导电膜定位成面对电子部件的后表面。 第一绝缘层具有设定为高于第二绝缘层的热膨胀系数的热膨胀系数。

公开(公告)号：US09288910B2

公开(公告)日：2016-03-15

申请号：US14555856

申请日：2014-11-28

Applicant: IBIDEN CO., LTD.

Inventor： Keisuke Shimizu ,  Yuichi Nakamura ,  Tsuyoshi Yamaguchi

IPC: H05K1/18 ,  H05K3/30 ,  H01L23/13 ,  H01L23/498 ,  H01L23/538 ,  H05K3/46

CPC classification number: H05K1/183 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/06152 ,  H01L2224/06153 ,  H01L2224/12105 ,  H01L2224/14152 ,  H01L2224/14153 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/15153 ,  H01L2924/15313 ,  H05K1/181 ,  H05K1/185 ,  H05K3/30 ,  H05K3/4602 ,  H05K2201/096 ,  H05K2201/10674 ,  Y10T29/4913

Abstract: A substrate with a built-in electronic component includes multiple resin insulating layers including first, second, third and fourth insulating layers, multiple conductor layers including a first wiring layer including a first pad, a second wiring layer including a second pad, and a third wiring layer including third and fourth pads, multiple via conductors including a first via connecting the first and second pads through the second insulating layer, a second via connecting the second and third pads through the third and fourth insulating layers, and a third via connected to the fourth pad through the fourth insulating layer, and an electronic component positioned a cavity through the second and third insulating layers such that the third via is connecting terminal of the component and fourth pad. The second and third vias have filled plating filling opening portions through the third and fourth insulating layers and through the fourth insulating layer.

Abstract translation: 具有内置电子部件的基板包括包括第一，第二，第三和第四绝缘层的多个树脂绝缘层，多个导体层，包括包括第一焊盘的第一布线层，包括第二焊盘的第二布线层和第三焊盘的第三布线层 包括第三和第四焊盘的布线层，多个通孔导体，包括通过第二绝缘层连接第一和第二焊盘的第一通孔，通过第三和第四绝缘层连接第二和第三焊盘的第二通孔，以及连接到 通过第四绝缘层的第四焊盘和通过第二和第三绝缘层定位空腔的电子部件，使得第三通孔是部件和第四焊盘的连接端子。 第二和第三通孔已经通过第三绝缘层和第四绝缘层填充电镀填充开口部分并穿过第四绝缘层。

公开(公告)号：US11437290B2

公开(公告)日：2022-09-06

申请号：US16869945

申请日：2020-05-08

Applicant: IBIDEN CO., LTD.

Inventor： Yusuke Tanaka ,  Tomohiro Futatsugi ,  Yuichi Nakamura ,  Yoshiki Matsui ,  Keinosuke Ino ,  Tomohiro Fuwa ,  Seiji Izawa

IPC: H01L23/28 ,  H01L23/13 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29

Abstract: An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.

公开(公告)号：US09832878B2

公开(公告)日：2017-11-28

申请号：US14819579

申请日：2015-08-06

Applicant: IBIDEN CO., LTD.

Inventor： Keisuke Shimizu ,  Makoto Terui ,  Ryojiro Tominaga ,  Yuichi Nakamura

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  H05K1/02 ,  H05K3/42

CPC classification number: H05K1/185 ,  H05K1/0224 ,  H05K3/305 ,  H05K3/429 ,  H05K3/4694 ,  H05K2201/09536 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/2072

Abstract: A wiring board with a cavity for a built-in electronic component includes a conductor layer including a conductor circuit layer and a plane layer, and an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion of the plane layer and formed to mount a built-in electronic component on the exposed portion of the plane layer. The plane layer has a recess structure formed in an outer peripheral portion in the exposed portion of the plane layer.

公开(公告)号：US09474158B2

公开(公告)日：2016-10-18

申请号：US14329453

申请日：2014-07-11

Applicant: IBIDEN CO., LTD.

Inventor： Toshiki Furutani ,  Takeshi Furusawa ,  Keisuke Shimizu ,  Yuichi Nakamura

IPC: H05K1/18 ,  H05K3/46 ,  H01L23/00 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H01L21/56

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/1533 ,  H01L2924/18162 ,  H01L2924/19105 ,  H05K1/0203 ,  H05K1/113 ,  H05K3/0097 ,  H05K3/3489 ,  H05K3/4602 ,  H05K3/4673 ,  H05K2201/068 ,  H05K2201/094 ,  H05K2203/1536 ,  H05K2203/308 ,  H01L2224/19

Abstract: A wiring board includes a first resin insulation layer, an electronic component positioned on first surface of the first insulation layer, a second resin insulation layer formed on the first surface of the first insulation layer such that the second insulation layer is embedding the electronic component, a conductive layer formed on the second insulation layer, a third resin insulation layer formed on the conductive layer and second insulation layer, and a connection via conductor formed in the second insulation layer such that the connection via conductor is connecting electrode of the electronic component and conductive layer on the second insulation layer. The first insulation layer has a pad structure on second surface side of the first insulation layer on opposite side of the first surface, and the first insulation layer has coefficient of thermal expansion set lower than coefficients of thermal expansion of the second and third insulation layers.

Abstract translation: 布线板包括第一树脂绝缘层，位于第一绝缘层的第一表面上的电子部件，形成在第一绝缘层的第一表面上的第二树脂绝缘层，使得第二绝缘层嵌入电子部件， 形成在第二绝缘层上的导电层，形成在导电层和第二绝缘层上的第三树脂绝缘层和形成在第二绝缘层中的连接通孔导体，使得连接通孔导体是电子部件的连接电极和 第二绝缘层上的导电层。 第一绝缘层在第一绝缘层的与第一表面相对的第二表面侧具有衬垫结构，第一绝缘层的热膨胀系数设定为低于第二绝缘层和第三绝缘层的热膨胀系数。