公开(公告)号：US11792937B2

公开(公告)日：2023-10-17

申请号：US17469124

申请日：2021-09-08

申请人： IBIDEN CO., LTD.

发明人： Takahiro Yamada ,  Seiji Izawa ,  Katsuyuki Sano

IPC分类号： H05K1/18 ,  H05K1/11

CPC分类号： H05K1/183 ,  H05K1/113 ,  H05K1/185 ,  H05K2201/096

摘要： A component built-in wiring substrate includes a first insulating layer, a first conductor layer formed on a first surface of the first insulating layer and including a component mounting pad, a second conductor layer formed on a second surface of the first insulating layer on the opposite side with respect to the first surface, via conductors formed in the first insulating layer such that the via conductors are connecting the second conductor layer and the component mounting pad of the first conductor layer, a second insulating layer formed on the first insulating layer and having a component accommodating portion penetrating through the second insulating layer such that the component mounting pad is positioned at bottom of the accommodating portion, and an electronic component positioned in the accommodating portion of the second insulating layer such that the electronic component is mounted on the component mounting pad of the first conductor layer.

公开(公告)号：US11935801B2

公开(公告)日：2024-03-19

申请号：US17730623

申请日：2022-04-27

申请人： IBIDEN CO., LTD.

发明人： Yusuke Tanaka ,  Tomohiro Futatsugi ,  Yuichi Nakamura ,  Yoshiki Matsui ,  Keinosuke Ino ,  Tomohiro Fuwa ,  Seiji Izawa

IPC分类号： H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/13 ,  H01L23/29 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L23/13 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/56 ,  H01L23/291 ,  H01L23/3171 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838

摘要： An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.

公开(公告)号：US11437290B2

公开(公告)日：2022-09-06

申请号：US16869945

申请日：2020-05-08

申请人： IBIDEN CO., LTD.

发明人： Yusuke Tanaka ,  Tomohiro Futatsugi ,  Yuichi Nakamura ,  Yoshiki Matsui ,  Keinosuke Ino ,  Tomohiro Fuwa ,  Seiji Izawa

IPC分类号： H01L23/28 ,  H01L23/13 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29

摘要： An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.