公开(公告)号：US20190104615A1

公开(公告)日：2019-04-04

申请号：US16145590

申请日：2018-09-28

申请人： IBIDEN CO., LTD.

发明人： Toshiki Furutani ,  Yukinobu Mikado ,  Yoshiki Matsui ,  Yusuke Tanaka

IPC分类号： H05K1/18 ,  H05K1/11 ,  H05K3/28 ,  H05K3/42

摘要： A printed wiring board includes a core substrate, a first resin insulating layer formed on a first surface of the core substrate, a second resin insulating layer formed on a second surface of the core substrate on the opposite side of the first surface, an electronic component accommodated in opening portion formed in the core substrate, and a filling resin filling space formed between the electronic component and an inner wall of the opening portion and including resin material that is different from resin material forming the first and second resin insulating layers. The core substrate has a first conductor pattern forming a first outermost layer of the core substrate and a second conductor pattern forming a second outermost layer of the core substrate on the opposite side of the first conductor pattern, and the filling resin is filling spaces formed in the second conductor pattern of the core substrate.

公开(公告)号：US11160168B2

公开(公告)日：2021-10-26

申请号：US16871431

申请日：2020-05-11

申请人： IBIDEN CO., LTD.

发明人： Yusuke Tanaka ,  Tomohiro Futatsugi ,  Yuichi Nakamura ,  Yoshiki Matsui

IPC分类号： H05K1/18 ,  H05K1/02 ,  H05K3/28 ,  H05K3/46 ,  H05K3/00

摘要： A wiring board for a built-in electronic component includes a first insulating layer, a second insulating layer formed under the first insulating layer, and a conductor layer formed on an upper surface of the second insulating layer such that a cavity is formed to penetrate through the first insulating layer and the conductor layer and expose the second insulating layer at a bottom of the cavity and is formed to accommodate an electronic component therein. The first insulating layer and the conductor layer are formed such that the cavity has a first inner side surface extending from an upper opening edge to a position closer to the second insulating layer, and a lateral expansion part formed between a lower edge of the first inner side surface and the second insulating layer and extending outward from the lower edge of the first inner side surface.

公开(公告)号：US11437290B2

公开(公告)日：2022-09-06

申请号：US16869945

申请日：2020-05-08

申请人： IBIDEN CO., LTD.

发明人： Yusuke Tanaka ,  Tomohiro Futatsugi ,  Yuichi Nakamura ,  Yoshiki Matsui ,  Keinosuke Ino ,  Tomohiro Fuwa ,  Seiji Izawa

IPC分类号： H01L23/28 ,  H01L23/13 ,  H01L23/498 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29

摘要： An electronic component built-in wiring board includes a substrate having a cavity, an electronic component accommodated in the cavity of the substrate and having pads on a surface of the component, a coating insulating layer formed on the substrate such that the insulating layer is covering the component and has via holes, via conductors formed in the via holes such that the via conductors are penetrating through the insulating layer, and a resin coating formed between the component and the insulating layer and having through holes such that the through holes are partially exposing the pads in the via holes and that the coating has adhesion to the component that is stronger than adhesion of the insulating layer to the component. The via conductors are formed in the via holes and the through holes such that the via conductors are connected to the pads on the surface of the component.