公开(公告)号：US3589704A

公开(公告)日：1971-06-29

申请号：US3589704D

申请日：1968-11-12

Applicant: IBM

Inventor： KURTZ FRANK J

IPC: B23Q3/08 ,  H05K7/14 ,  B25B11/00

CPC classification number: H05K7/14 ,  B23Q3/08

Abstract: A fluid underlying or encasing a thin multilayer printed circuit device with an irregular underside structure provides uniform backing support for electrical probing of the device. In this instance the irregular structure is formed in relief from a main substrate board by joinder to the board of external circuit chip elements and discrete point-to-point connection wires. In one embodiment the device is clamped in a work holder with which it forms an airtight chamber. This chamber is filled to capacity with an incompressible dielectric fluid which supports the device and enables it to withstand substantial external forces as might be caused by the pressure of a matrix of test probes. Supply and vent valves are manipulated first to admit the fluid while releasing entrapped air and then to isolate the fluid when the chamber is filled so that external forces are transferred to the fluid only through the chamber wall formed by the device. The same valves are manipulated in reverse to remove fluid as one device is uncoupled from the fixture and replaced by another.

公开(公告)号：US3171205A

公开(公告)日：1965-03-02

申请号：US24860362

申请日：1962-12-31

Applicant: IBM

Inventor： KURTZ FRANK J

IPC: G01B9/02

CPC classification number: G01B11/0675

公开(公告)号：US3496634A

公开(公告)日：1970-02-24

申请号：US3496634D

申请日：1966-12-30

Applicant: IBM

Inventor： KURTZ FRANK J ,  LOGUE JOSEPH C

IPC: H05K7/06 ,  H05K9/00 ,  H01B13/00

CPC classification number: H05K7/06 ,  H05K9/00 ,  Y10T29/49083 ,  Y10T29/49179 ,  Y10T29/49986