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公开(公告)号：US20200186067A1
公开(公告)日：2020-06-11
申请号：US16692279
申请日：2019-11-22
Applicant: ICP Technology Co., Ltd. , Sentec E&E Co., Ltd.
Inventor： Ho-Chieh Yu , Chen-Cheng-Lung Liao , Chun-Yu Lin , Jason An Cheng Huang
Abstract: A motor control device with built-in shunt resistor and power transistor is disclosed, comprising a high-thermally conductive substrate; an electrically conductive circuit which is thermo-conductively installed on the high-thermally conductive substrate and includes a first thermal connection pad portion and a second thermal connection pad portion mutually spaced apart; a high power transistor conductively connected to the electrical conducive circuit; and a shunt resistor conductively connected to the high power transistor, respectively including a body whose thermal expansion coefficient is greater than that of the high-thermally conductive substrate, as well as a pair of welding portions extending from the body, in which the body has a prescribed width, and the width of the welding portion is greater than the prescribed width, and the body and the high-thermally conductive substrate are spaced apart such that, upon welding the welding portion to the first thermal connection pad portion and the second thermal connection pad portion, the thermal expansion stress occurring between the body and the high-thermally conductive substrate can be distributed and undertaken in the width direction.
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Patent Agency Ranking
公开(公告)号：US11043911B2
公开(公告)日：2021-06-22
申请号：US16692279
申请日：2019-11-22
Applicant: ICP Technology Co., Ltd. , Sentec E&E Co., Ltd.
Inventor： Ho-Chieh Yu , Chen-Cheng-Lung Liao , Chun-Yu Lin , Jason An Cheng Huang
Abstract: A motor control device with built-in shunt resistor and power transistor is disclosed, comprising a high-thermally conductive substrate; an electrically conductive circuit which is thermo-conductively installed on the high-thermally conductive substrate and includes a first thermal connection pad portion and a second thermal connection pad portion mutually spaced apart; a high power transistor conductively connected to the electrical conducive circuit; and a shunt resistor conductively connected to the high power transistor, respectively including a body whose thermal expansion coefficient is greater than that of the high-thermally conductive substrate, as well as a pair of welding portions extending from the body, in which the body has a prescribed width, and the width of the welding portion is greater than the prescribed width, and the body and the high-thermally conductive substrate are spaced apart such that, upon welding the welding portion to the first thermal connection pad portion and the second thermal connection pad portion, the thermal expansion stress occurring between the body and the high-thermally conductive substrate can be distributed and undertaken in the width direction.
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公开(公告)号：US10743411B1
公开(公告)日：2020-08-11
申请号：US16737288
申请日：2020-01-08
Inventor： Ho-Chieh Yu , Chen-Cheng-Lung Liao , Chun-Yu Lin , Hsiao-Ming Chang , Jing-Yao Chang , Tao-Chih Chang
Abstract: A ceramic substrate component suitable for high-power chips includes a ceramic substrate body and at least one raised metal pad. The ceramic substrate body has an upper surface and a lower surface opposite to the upper surface. The raised metal pad includes a base portion and a top layer. The base portion, which is attached to the upper surface of the ceramic substrate body, has a thickness between 10 and 300 micrometers, and a thermal expansion coefficient greater than the ceramic substrate body. The top layer is formed on the base portion and adapted to install a high-power chip thereon. The top layer extends an area less than the base portion but greater than the high-power chip, and has a thermal expansion coefficient greater than the ceramic substrate body. As such, damages due to thermal stress occurring between the base portion and the ceramic substrate body can be mitigated.
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4.发明申请公开(公告)号：US20200245456A1
公开(公告)日：2020-07-30
申请号：US16737288
申请日：2020-01-08
Inventor： Ho-Chieh Yu , Chen-Cheng-Lung Liao , Chun-Yu Lin , Hsiao-Ming Chang , Jing-Yao Chang , Tao-Chih Chang
Abstract: A ceramic substrate component suitable for high-power chips includes a ceramic substrate body and at least one raised metal pad. The ceramic substrate body has an upper surface and a lower surface opposite to the upper surface. The raised metal pad includes a base portion and a top layer. The base portion, which is attached to the upper surface of the ceramic substrate body, has a thickness between 10 and 300 micrometers, and a thermal expansion coefficient greater than the ceramic substrate body. The top layer is formed on the base portion and adapted to install a high-power chip thereon. The top layer extends an area less than the base portion but greater than the high-power chip, and has a thermal expansion coefficient greater than the ceramic substrate body. As such, damages due to thermal stress occurring between the base portion and the ceramic substrate body can be mitigated.
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5.发明申请公开(公告)号：US20180352646A1
公开(公告)日：2018-12-06
申请号：US15995756
申请日：2018-06-01
Applicant: ICP Technology Co., Ltd. , Xiamen Sentecee E&E Co., Ltd.
Inventor： Ho-Chieh Yu , Cheng-Lung Liao , Chun-Yu Lin , Jason An-Cheng Huang
Abstract: A printed circuit board with built-in vertical heat dissipation ceramic block, and an electrical assembly are disclosed. The electrical assembly includes the board and a plurality of electronic components. The printed circuit boards includes a dielectric material layer defining at least one through hole, at least one ceramic block corresponding to the through hole, at least one fixing portion for joining the ceramic block to the through hole of the dielectric material layer, a metal circuit layer provided on upper surfaces of the dielectric material layer and the ceramic block, and a high thermal conductivity layer provided on lower surfaces of the dielectric material layer and the ceramic block. The printed circuit board allows the location and size of the ceramic block to be modified according to requirements, so as to implement complicated circuit designs, achieve good effect of thermal conduction, control thermal conduction path, and reduce manufacturing cost.
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公开(公告)号：US10524349B2
公开(公告)日：2019-12-31
申请号：US15995756
申请日：2018-06-01
Applicant: ICP Technology Co., Ltd. , Xiamen Sentecee E&E Co., Ltd.
Inventor： Ho-Chieh Yu , Cheng-Lung Liao , Chun-Yu Lin , Jason An-Cheng Huang
IPC: H05K1/02 , H05K1/03 , H01L23/373 , H05K1/18 , H01L23/367 , F21V29/76 , H01L33/64 , F21S8/08 , F21Y115/10 , F21V29/503
Abstract: A printed circuit board with built-in vertical heat dissipation ceramic block, and an electrical assembly are disclosed. The electrical assembly includes the board and a plurality of electronic components. The printed circuit boards includes a dielectric material layer defining at least one through hole, at least one ceramic block corresponding to the through hole, at least one fixing portion for joining the ceramic block to the through hole of the dielectric material layer, a metal circuit layer provided on upper surfaces of the dielectric material layer and the ceramic block, and a high thermal conductivity layer provided on lower surfaces of the dielectric material layer and the ceramic block. The printed circuit board allows the location and size of the ceramic block to be modified according to requirements, so as to implement complicated circuit designs, achieve good effect of thermal conduction, control thermal conduction path, and reduce manufacturing cost.
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