公开(公告)号：US20170005018A1

公开(公告)日：2017-01-05

申请号：US15193383

申请日：2016-06-27

Applicant: IMEC vzw

Inventor： Ingrid De Wolf ,  Murali Jayapala ,  Arnita Podpod ,  John Slabbekoorn ,  Carolina Blanch Perez del Notario

IPC: H01L21/66 ,  G05B19/418 ,  H01L21/677 ,  H01L21/683 ,  H01L21/02 ,  H01L21/56 ,  G06T7/00 ,  H01L21/67

CPC classification number: H01L22/20 ,  G01N21/00 ,  G01N21/31 ,  G05B19/418 ,  G05B2219/45031 ,  G06T7/001 ,  G06T2207/20081 ,  G06T2207/30148 ,  H01L21/02076 ,  H01L21/6835 ,  H01L21/6836 ,  H01L22/12 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/1181 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/83193 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2224/11

Abstract: A method for inspection of a semiconductor device is disclosed. In one aspect, the method includes performing a processing step in manufacturing of the semiconductor device, wherein a compound is at least in contact with the semiconductor device. The method also includes capturing an image on a two-dimensional image sensor of an area of at least part of the semiconductor device, wherein the captured image comprises spectral information for a plurality of positions in the area, and wherein the spectral information comprises intensity of incident electro-magnetic radiation for a plurality of different wavelength bands across a spectrum of wavelengths. The method also includes processing the spectral information of the captured image for each of the plurality of positions to determine whether residue of the compound is present in the position. The method also includes outputting information indicating positions for which residue of the compound is present for controlling a subsequent processing step in manufacturing of the semiconductor device.

Abstract translation: 公开了一种用于检查半导体器件的方法。 一方面，该方法包括在半导体器件的制造中执行处理步骤，其中化合物至少与半导体器件接触。 该方法还包括在半导体器件的至少一部分的区域的二维图像传感器上捕获图像，其中所捕获的图像包括用于该区域中的多个位置的光谱信息，并且其中光谱信息包括 在波长范围内的多个不同波长带的入射电磁辐射。 该方法还包括处理多个位置中的每一个的捕获图像的光谱信息，以确定化合物的残留物是否存在于该位置。 该方法还包括输出指示化合物的残留物的位置的信息，以控制半导体器件的制造中的后续处理步骤。