公开(公告)号：US20170326688A1

公开(公告)日：2017-11-16

申请号：US15658944

申请日：2017-07-25

Applicant: IMRA America, Inc.

Inventor： Mark Turner ,  Alan Y. Arai ,  Michiharu Ota

IPC: B23K26/382 ,  B23K26/142 ,  B23K26/402 ,  B23K26/0622 ,  B23K26/146 ,  B23K26/082 ,  B23K26/067 ,  B23K103/00

CPC classification number: B23K26/382 ,  B23K26/0624 ,  B23K26/064 ,  B23K26/0676 ,  B23K26/082 ,  B23K26/122 ,  B23K26/142 ,  B23K26/146 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54

Abstract: The present disclosure provides examples of a laser-based material processing system for liquid-assisted, ultrashort pulse (USP) laser micromachining An example material processing application includes drilling thru-holes or blind holes in a nearly transparent glass workpiece (substrate) using parallel processing with an n×m array of focused laser beams. Methods and systems are disclosed herein which provide for formation of high aspect ratio holes with low taper in fine pitch arrangements.