公开(公告)号：US20140166065A1

公开(公告)日：2014-06-19

申请号：US13798121

申请日：2013-03-13

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ming-Sheng Leu ,  Tai-Sheng Chen ,  Chih-Chao Shih

IPC: H01L35/10 ,  H01L35/14

CPC classification number: H01L35/10 ,  H01L35/14 ,  H01L35/16 ,  H01L35/18 ,  H01L35/22

Abstract: A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.

Abstract translation: 提供了包括热电基片和一对第一金刚石碳（DLC）层的热电膜的结构。 第一DLC层分别位于热电基板的两个相对的表面上并具有导电性。

公开(公告)号：US20160005943A1

公开(公告)日：2016-01-07

申请号：US14855403

申请日：2015-09-16

Applicant: Industrial Technology Research Institute

Inventor： Ming-Sheng Leu ,  Tai-Sheng Chen ,  Chih-Chao Shih

IPC: H01L35/10 ,  H01L35/16 ,  H01L35/22 ,  H01L35/18

CPC classification number: H01L35/10 ,  H01L35/14 ,  H01L35/16 ,  H01L35/18 ,  H01L35/22

Abstract: A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.

Abstract translation: 提供了包括热电基片和一对第一金刚石碳（DLC）层的热电膜的结构。 第一DLC层分别位于热电基板的两个相对的表面上并具有导电性。

公开(公告)号：US09385291B2

公开(公告)日：2016-07-05

申请号：US14855403

申请日：2015-09-16

Applicant: Industrial Technology Research Institute

Inventor： Ming-Sheng Leu ,  Tai-Sheng Chen ,  Chih-Chao Shih

IPC: H01L35/10 ,  H01L35/18 ,  H01L35/16 ,  H01L35/22 ,  H01L35/14

CPC classification number: H01L35/10 ,  H01L35/14 ,  H01L35/16 ,  H01L35/18 ,  H01L35/22

Abstract: A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.

公开(公告)号：US09166137B2

公开(公告)日：2015-10-20

申请号：US13798121

申请日：2013-03-13

Applicant: Industrial Technology Research Institute

Inventor： Ming-Sheng Leu ,  Tai-Sheng Chen ,  Chih-Chao Shih

IPC: H01L35/10 ,  H01L35/14

CPC classification number: H01L35/10 ,  H01L35/14 ,  H01L35/16 ,  H01L35/18 ,  H01L35/22

Abstract: A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.

Abstract translation: 提供了包括热电基片和一对第一金刚石碳（DLC）层的热电膜的结构。 第一DLC层分别位于热电基板的两个相对的表面上并具有导电性。