公开(公告)号：US20140166065A1

公开(公告)日：2014-06-19

申请号：US13798121

申请日：2013-03-13

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Ming-Sheng Leu ,  Tai-Sheng Chen ,  Chih-Chao Shih

IPC: H01L35/10 ,  H01L35/14

CPC classification number: H01L35/10 ,  H01L35/14 ,  H01L35/16 ,  H01L35/18 ,  H01L35/22

Abstract: A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.

Abstract translation: 提供了包括热电基片和一对第一金刚石碳（DLC）层的热电膜的结构。 第一DLC层分别位于热电基板的两个相对的表面上并具有导电性。

公开(公告)号：US10894288B2

公开(公告)日：2021-01-19

申请号：US15394109

申请日：2016-12-29

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tai-Sheng Chen ,  Ming-Sheng Leu ,  Hong-Jen Lai ,  Wu-Han Liu

IPC: B22F1/02 ,  C04B35/628 ,  C23C18/16 ,  C23C18/31 ,  C22C1/05 ,  C22C32/00 ,  C23C18/18 ,  C23C18/36

Abstract: A surface-treated ceramic powder includes a plurality of ceramic particles and a surface-treating material. Each of the ceramic particles is at least partially coated by the surface-treating material, wherein the ceramic particles have an average particle diameter ranging from 10 micrometer (μm) to 100 μm, and the surface-treating material is made of metal, metal oxide or the combination thereof.

公开(公告)号：US09385291B2

公开(公告)日：2016-07-05

申请号：US14855403

申请日：2015-09-16

Applicant: Industrial Technology Research Institute

Inventor： Ming-Sheng Leu ,  Tai-Sheng Chen ,  Chih-Chao Shih

IPC: H01L35/10 ,  H01L35/18 ,  H01L35/16 ,  H01L35/22 ,  H01L35/14

CPC classification number: H01L35/10 ,  H01L35/14 ,  H01L35/16 ,  H01L35/18 ,  H01L35/22

Abstract: A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.

公开(公告)号：US10195816B2

公开(公告)日：2019-02-05

申请号：US14586171

申请日：2014-12-30

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Hong-Jen Lai ,  Ming-Sheng Leu ,  Tai-Sheng Chen ,  Wei-Tien Hsiao

IPC: B32B3/28 ,  C23C16/02 ,  C23C14/02 ,  B32B15/08 ,  A61L27/56 ,  C23C14/20 ,  C23C16/06

Abstract: A metal/polymer composite material is disclosed, wherein the metal/polymer composite material comprises a polymer base and a metal heat-dissipation layer. The heat-dissipation layer comprises a roughed surface with an isotropic surface roughness. The metal heat-dissipation conformally blankets over the roughed surface.

公开(公告)号：US20160005943A1

公开(公告)日：2016-01-07

申请号：US14855403

申请日：2015-09-16

Applicant: Industrial Technology Research Institute

Inventor： Ming-Sheng Leu ,  Tai-Sheng Chen ,  Chih-Chao Shih

IPC: H01L35/10 ,  H01L35/16 ,  H01L35/22 ,  H01L35/18

CPC classification number: H01L35/10 ,  H01L35/14 ,  H01L35/16 ,  H01L35/18 ,  H01L35/22

Abstract: A structure of a thermoelectric film including a thermoelectric substrate and a pair of first diamond-like carbon (DLC) layers is provided. The first DLC layers are respectively located on two opposite surfaces of the thermoelectric substrate and have electrical conductivity.

Abstract translation: 提供了包括热电基片和一对第一金刚石碳（DLC）层的热电膜的结构。 第一DLC层分别位于热电基板的两个相对的表面上并具有导电性。

公开(公告)号：US20230074335A1

公开(公告)日：2023-03-09

申请号：US17493863

申请日：2021-10-05

Applicant: Industrial Technology Research Institute

Inventor： Wu-Han Liu ,  Yi-Liang Liao ,  Tai-Sheng Chen ,  Wei-Tien Hsiao ,  Chang-Chih Hsu

IPC: C23C4/10 ,  C23C4/06 ,  C22C29/06

Abstract: A composite structure with an aluminum-based alloy layer containing boron carbide and a manufacturing method thereof are provided. The composite structure includes a substrate with an open hole in that surface and the aluminum-based alloy layer containing boron carbide. The aluminum-based alloy layer is disposed in the open hole and contains aluminum, boron, carbon, and oxygen, wherein the content of aluminum is between 4 at. % and 55 at. %, the content of boron is between 9 at. % and 32 at. %, the content of carbon is between 13 at. % and 32 at. %, the content of oxygen is between 2 at. % and 38 at. %, and the ratio of the content of boron to carbon is between 0.3 and 2.7.

公开(公告)号：US20210282253A1

公开(公告)日：2021-09-09

申请号：US17327783

申请日：2021-05-24

Applicant: Industrial Technology Research Institute

Inventor： Ding-Shiang Wang ,  Jia-Jen Chang ,  Ming-Sheng Leu ,  Tai-Sheng Chen ,  Chin-Te Shih

IPC: H05F3/04 ,  H01L21/673 ,  B65G47/74 ,  C23C14/02 ,  C23C14/14 ,  C23C14/08 ,  C23C14/00 ,  C23C14/32

Abstract: A manufacturing method of the ESD protection device includes the following steps. A surface treatment is performed on the substrate. A link layer is formed on the substrate after the surface treatment, wherein a material of the link layer includes a metal material. A progressive layer is formed on the link layer, wherein a material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. A composite layer is formed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×107 to 1×108 Ω/sq.

公开(公告)号：US11044798B2

公开(公告)日：2021-06-22

申请号：US16152425

申请日：2018-10-05

Applicant: Industrial Technology Research Institute

Inventor： Ding-Shiang Wang ,  Jia-Jen Chang ,  Ming-Sheng Leu ,  Tai-Sheng Chen ,  Chin-Te Shih

IPC: H05F3/04 ,  H01L21/673 ,  B65G47/74 ,  C23C14/02 ,  C23C14/14 ,  C23C14/08 ,  C23C14/00 ,  C23C14/32

Abstract: An ESD protection composite structure includes a link layer, a progressive layer, and a composite layer. The link layer is used for disposing the ESD protection composite structure on a substrate, wherein a material of the link layer includes a metal material. The progressive layer is disposed on the link layer, wherein the material of the progressive layer includes a non-stoichiometric metal oxide material, and an oxygen concentration in the non-stoichiometric metal oxide material is increased gradually away from the substrate in a thickness direction of the progressive layer. The composite layer is disposed on the progressive layer, wherein the composite layer includes a stoichiometric metal oxide material and a non-stoichiometric metal oxide material, and a ratio of the non-stoichiometric metal oxide material and the stoichiometric metal oxide material in the composite layer may make a sheet resistance value of the composite layer 1×107 Ω/sq to 1×108 Ω/sq.

公开(公告)号：US10428413B2

公开(公告)日：2019-10-01

申请号：US14981972

申请日：2015-12-29

Applicant: Industrial Technology Research Institute

Inventor： Tai-Sheng Chen ,  Ming-Sheng Leu ,  Wu-Han Liu ,  Jia-Jen Chang

IPC: C22F1/18 ,  C23F17/00 ,  C23C4/18 ,  C22F1/057 ,  C23C14/58 ,  C23C4/134 ,  C23C4/08 ,  C23C4/06 ,  C23C14/14 ,  C23C14/35

Abstract: A hydrophobic alloy film and a manufacturing method thereof are provided. The hydrophobic alloy film includes Al, Cu, O, and at least one selected from the group consisting of Fe, Co, Ni, and Cr, or Ti, Zr, O, and at least one selected from the group consisting of Fe, Co, Ni, and Cr. The content of each of Al and Ti is in the range of 40 at. % to 70 at. %. The content of each of Cu and Zr is in the range of 10 at. % to 40 at. %. The total content of at least one selected from the group consisting of Fe, Co, Ni, and Cr is in the range of 10 at. % to 30 at. %. The content of O is in the range of 10 at. % to 30 at. %. The hydrophobic alloy film has a quasicrystal structure and nanoparticles.

公开(公告)号：US11643715B2

公开(公告)日：2023-05-09

申请号：US17493863

申请日：2021-10-05

Applicant: Industrial Technology Research Institute

Inventor： Wu-Han Liu ,  Yi-Liang Liao ,  Tai-Sheng Chen ,  Wei-Tien Hsiao ,  Chang-Chih Hsu

IPC: C23C4/10 ,  C23C4/06 ,  C22C29/06 ,  B32B15/01 ,  B32B3/26 ,  B32B15/20 ,  B32B15/04 ,  C22C32/00 ,  C22C29/02 ,  C22C30/00 ,  C22C1/05 ,  C22C29/14 ,  C22C1/051 ,  C22C29/00 ,  C22C21/00 ,  C23C4/067 ,  B32B3/30 ,  C22C1/02 ,  C22C1/053

CPC classification number: C23C4/10 ,  B32B3/26 ,  B32B3/266 ,  B32B3/30 ,  B32B15/016 ,  B32B15/017 ,  B32B15/04 ,  B32B15/043 ,  B32B15/20 ,  C22C1/026 ,  C22C1/05 ,  C22C1/051 ,  C22C1/053 ,  C22C21/00 ,  C22C29/005 ,  C22C29/02 ,  C22C29/06 ,  C22C29/062 ,  C22C29/14 ,  C22C30/00 ,  C22C32/0005 ,  C22C32/0052 ,  C22C32/0057 ,  C22C32/0073 ,  C23C4/06 ,  C23C4/067 ,  B32B2255/06 ,  B32B2255/205 ,  B32B2311/24 ,  B32B2313/02 ,  Y10T428/1275 ,  Y10T428/12361 ,  Y10T428/12368 ,  Y10T428/12493 ,  Y10T428/12576 ,  Y10T428/12736 ,  Y10T428/12743 ,  Y10T428/12757 ,  Y10T428/12764 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/26

Abstract: A composite structure with an aluminum-based alloy layer containing boron carbide and a manufacturing method thereof are provided. The composite structure includes a substrate with an open hole in that surface and the aluminum-based alloy layer containing boron carbide. The aluminum-based alloy layer is disposed in the open hole and contains aluminum, boron, carbon, and oxygen, wherein the content of aluminum is between 4 at. % and 55 at. %, the content of boron is between 9 at. % and 32 at. %, the content of carbon is between 13 at. % and 32 at. %, the content of oxygen is between 2 at. % and 38 at. %, and the ratio of the content of boron to carbon is between 0.3 and 2.7.