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公开(公告)号:US20140138734A1
公开(公告)日:2014-05-22
申请号:US14017678
申请日:2013-09-04
Inventor: Wen-Hsien WANG , Min-Tsung KUAN , Tzong-Ming LEE , Wen-Hsien CHOU , Fu-Ming LIN , Wen-Kuei LEE , Chin Zeng YEH , Ming-Hung CHEN , Chung-Teng HUANG , Hsueh Jen FU
IPC: H01L33/56 , H01L31/0203
CPC classification number: H01L33/56 , B32B27/08 , B32B27/302 , B32B27/306 , B32B27/32 , B32B2250/24 , B32B2307/558 , B32B2457/00 , B32B2457/202 , C08L2203/204 , C09D123/02 , C09D123/0853 , H01L31/0481 , H01L31/049 , H01L51/524 , H01L51/5253 , Y02E10/50
Abstract: Disclosed is a module structure including a front sheet, a back sheet, and an optoelectronic device disposed between the front sheet and the back sheet. A first packaging layer is disposed between the optoelectronic device and the front sheet. The back sheet is a layered structure of a hydrogenated styrene elastomer resin layer and a polyolefin layer, wherein the hydrogenated styrene elastomer resin layer is disposed between the optoelectronic device and the polyolefin layer.
Abstract translation: 公开了一种模块结构,其包括前片,背片和设置在前片与后片之间的光电器件。 第一包装层设置在光电器件和前片之间。 背板是氢化苯乙烯弹性体树脂层和聚烯烃层的层叠结构,其中氢化苯乙烯弹性体树脂层设置在光电子器件和聚烯烃层之间。
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公开(公告)号:US20130306132A1
公开(公告)日:2013-11-21
申请号:US13728791
申请日:2012-12-27
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Inventor: Cheng-Yu PENG , Chung-Teng HUANG , Fu-Ming LIN
IPC: H01L31/052 , H01L31/0232
CPC classification number: H01L31/02327 , H01L31/02325 , H01L31/049 , H01L31/056 , H02S20/22 , Y02B10/10 , Y02E10/52
Abstract: A solar photoelectrical module is disclosed, including a back sheet, a plurality of solar cells disposed over the back sheet and adjacent to at least one side of the back sheet, a first package material layer disposed on the back sheet, a second package material layer disposed on the first package material layer, wherein an interface between the first package material layer and the second package material layer comprises a first texture structure.
Abstract translation: 公开了一种太阳光电模块,包括背板,设置在背板上并与背板的至少一侧相邻的多个太阳能电池,设置在背板上的第一包装材料层,第二包装材料层 设置在第一包装材料层上,其中第一包装材料层和第二包装材料层之间的界面包括第一纹理结构。
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