公开(公告)号：US20180175702A1

公开(公告)日：2018-06-21

申请号：US15386350

申请日：2016-12-21

Applicant: Industrial Technology Research Institute

Inventor： Ping-Lun LI ,  Li-Song LIN

IPC: H02K9/06 ,  H02K5/18

CPC classification number: H02K9/06 ,  H02K1/32 ,  H02K5/18 ,  H02K2213/03

Abstract: A motor shaft system with a cooling function is provided, the motor shaft system has: a motor housing; a stator located on an inner wall of the motor housing; a shaft located in the motor housing, wherein the shaft comprises a plurality of through holes, one of the plurality of through holes penetrates from a first end of the shaft to a second end of the shaft along an axial direction of the shaft; a bearing located on the motor housing, wherein the bearing is configured to support the shaft; and a rotor located on the shaft, wherein there is a gap between the rotor and the stator.

公开(公告)号：US20170120719A1

公开(公告)日：2017-05-04

申请号：US14981118

申请日：2015-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Po-Hua CHANG ,  Min-Chuan WU ,  Wen-Shu CHIANG ,  Li-Song LIN ,  Kou-Tzeng LIN

IPC: B60H1/00

CPC classification number: B60H1/00321 ,  B60H1/00392 ,  H01L23/38

Abstract: A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one cooling chip. The heat-conducting layer has a heat-absorbing surface and a heat-dissipating surface. The heat sink is in thermal contact with the heat-dissipating surface, and a heat-conducting section is formed in the heat sink. The cooling chip is embedded in the heat sink and disposed adjacent to the heat transferring channel. The cooling chip has a cooling surface which is perpendicular to the heat-absorbing surface. The cooling surface faces the heat transferring channel. The cooling chip removes heat from the heat-conducting section in the heat sink.