公开(公告)号：US20190140230A1

公开(公告)日：2019-05-09

申请号：US15854649

申请日：2017-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Huan-Lung GU ,  Chia-Jui HU ,  Shao-Yu LEE ,  Min-Chuan WU ,  Yu-Yin PENG

IPC: H01M2/10 ,  B60K7/00 ,  B60L11/18 ,  H01M2/20 ,  H01M2/30

Abstract: The disclosure is related to an electric wheel, adapted to a wheel shaft. The electric wheel includes a wheel body, a battery holder, and at least one battery module. The wheel body has a wheel hub configured to be rotatably disposed on the wheel shaft. The battery holder includes a base and at least one first electrical connector connected to each other. The base is configured to be connected to the wheel shaft and disposed side by side to the wheel hub. The base has an outer surface facing away from the wheel shaft. The at least one battery module includes at least one battery storage and at least one second electrical connector. The at least one battery storage has an inner surface in contact with the outer surface of the base. The at least one second electrical connector is detachably mounted on the at least one first electrical connector.

公开(公告)号：US20160167518A1

公开(公告)日：2016-06-16

申请号：US14919237

申请日：2015-10-21

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Po-Hua CHANG ,  Kou-Tzeng LIN ,  Chih-Yu HWANG ,  Min-Chuan WU ,  Wen-Shu CHIANG

IPC: B60L1/12 ,  H01L35/30

CPC classification number: H01L35/30 ,  B60L1/02 ,  B60L3/003 ,  B60L3/0084 ,  B60L2240/36 ,  B60L2240/421 ,  B60L2240/423 ,  B60L2240/429 ,  H01L23/38 ,  H01L2924/0002 ,  Y02T10/642 ,  H01L2924/00

Abstract: A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one thermoelectric cooling chip. The heat-conducting layer has a heat-absorbing-surface and a heat-dissipating-surface which are opposite to each other. The heat sink is in thermal contact with the heat-dissipating-surface of the heat-conducting layer. The at least one thermoelectric cooling chip is embedded in the heat-conducting layer. The heat-conducting layer has an effective heat-conducting-region. A1 is the area on the heat-absorbing-surface which the effective heat-conducting-region projects on, and A2 is the area on the heat-absorbing-surface which the thermoelectric cooling chip projects on. The ratio of A2 to A1 is between 0.15 and 0.58.

Abstract translation: 电力散热装置包括导热层，散热片和至少一个热电冷却芯片。 导热层具有彼此相反的吸热面和散热面。 散热片与导热层的散热面热接触。 至少一个热电冷却芯片嵌入在导热层中。 导热层具有有效的导热区域。 A1是有效导热区域突出的吸热面上的面积，A2是热电冷却芯片投射的吸热面的面积。 A2与A1的比值在0.15和0.58之间。

公开(公告)号：US20170120719A1

公开(公告)日：2017-05-04

申请号：US14981118

申请日：2015-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Po-Hua CHANG ,  Min-Chuan WU ,  Wen-Shu CHIANG ,  Li-Song LIN ,  Kou-Tzeng LIN

IPC: B60H1/00

CPC classification number: B60H1/00321 ,  B60H1/00392 ,  H01L23/38

Abstract: A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one cooling chip. The heat-conducting layer has a heat-absorbing surface and a heat-dissipating surface. The heat sink is in thermal contact with the heat-dissipating surface, and a heat-conducting section is formed in the heat sink. The cooling chip is embedded in the heat sink and disposed adjacent to the heat transferring channel. The cooling chip has a cooling surface which is perpendicular to the heat-absorbing surface. The cooling surface faces the heat transferring channel. The cooling chip removes heat from the heat-conducting section in the heat sink.

公开(公告)号：US20150180311A1

公开(公告)日：2015-06-25

申请号：US14519046

申请日：2014-10-20

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kou-Tzeng LIN ,  Li-Fen LIU ,  Min-Chuan WU ,  An-Hung LIN ,  Shin-Hung CHANG ,  Po-Hua CHANG

IPC: H02K9/02 ,  H02K11/00 ,  H02K9/22

CPC classification number: H05K7/20909

Abstract: A motor controller and a cooling method thereof are provided. The motor controller includes: a first power module; a second power module; a first heat sink having first fins; a second heat sink having second fins; a first partition board; a second partition board; a housing disposed at external sides of the first and second partition boards, with a first channel formed between the housing and the first partition board; a conduit connected to a rear end of the first heat sink and extending to an outlet of the housing; a first flow channel; and a second flow channel passing through the first channel and the gaps of the second fins, for second cold air to be introduced, and processed by a heat exchange process performed by the second power module to generate second hot air that is expelled to the outlet of the housing through the second flow channel.

Abstract translation: 提供电机控制器及其冷却方法。 电机控制器包括：第一电源模块; 第二电源模块; 具有第一散热片的第一散热器; 具有第二散热片的第二散热器; 第一分隔板; 第二分隔板; 壳体，设置在第一和第二隔板的外侧，第一通道形成在壳体和第一隔板之间; 连接到第一散热器的后端并延伸到壳体的出口的导管; 第一流道; 以及通过所述第一通道和所述第二散热片的间隙的第二流动通道，用于要引入的第二冷空气，并且由所述第二电力模块执行的热交换过程进行处理，以产生排出到所述出口的第二热空气 的壳体通过第二流动通道。