公开(公告)号：US20160167518A1

公开(公告)日：2016-06-16

申请号：US14919237

申请日：2015-10-21

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Po-Hua CHANG ,  Kou-Tzeng LIN ,  Chih-Yu HWANG ,  Min-Chuan WU ,  Wen-Shu CHIANG

IPC: B60L1/12 ,  H01L35/30

CPC classification number: H01L35/30 ,  B60L1/02 ,  B60L3/003 ,  B60L3/0084 ,  B60L2240/36 ,  B60L2240/421 ,  B60L2240/423 ,  B60L2240/429 ,  H01L23/38 ,  H01L2924/0002 ,  Y02T10/642 ,  H01L2924/00

Abstract: A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one thermoelectric cooling chip. The heat-conducting layer has a heat-absorbing-surface and a heat-dissipating-surface which are opposite to each other. The heat sink is in thermal contact with the heat-dissipating-surface of the heat-conducting layer. The at least one thermoelectric cooling chip is embedded in the heat-conducting layer. The heat-conducting layer has an effective heat-conducting-region. A1 is the area on the heat-absorbing-surface which the effective heat-conducting-region projects on, and A2 is the area on the heat-absorbing-surface which the thermoelectric cooling chip projects on. The ratio of A2 to A1 is between 0.15 and 0.58.

Abstract translation: 电力散热装置包括导热层，散热片和至少一个热电冷却芯片。 导热层具有彼此相反的吸热面和散热面。 散热片与导热层的散热面热接触。 至少一个热电冷却芯片嵌入在导热层中。 导热层具有有效的导热区域。 A1是有效导热区域突出的吸热面上的面积，A2是热电冷却芯片投射的吸热面的面积。 A2与A1的比值在0.15和0.58之间。

公开(公告)号：US20170120719A1

公开(公告)日：2017-05-04

申请号：US14981118

申请日：2015-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Po-Hua CHANG ,  Min-Chuan WU ,  Wen-Shu CHIANG ,  Li-Song LIN ,  Kou-Tzeng LIN

IPC: B60H1/00

CPC classification number: B60H1/00321 ,  B60H1/00392 ,  H01L23/38

Abstract: A power heat dissipation device includes a heat-conducting layer, a heat sink and at least one cooling chip. The heat-conducting layer has a heat-absorbing surface and a heat-dissipating surface. The heat sink is in thermal contact with the heat-dissipating surface, and a heat-conducting section is formed in the heat sink. The cooling chip is embedded in the heat sink and disposed adjacent to the heat transferring channel. The cooling chip has a cooling surface which is perpendicular to the heat-absorbing surface. The cooling surface faces the heat transferring channel. The cooling chip removes heat from the heat-conducting section in the heat sink.

公开(公告)号：US20150180311A1

公开(公告)日：2015-06-25

申请号：US14519046

申请日：2014-10-20

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Kou-Tzeng LIN ,  Li-Fen LIU ,  Min-Chuan WU ,  An-Hung LIN ,  Shin-Hung CHANG ,  Po-Hua CHANG

IPC: H02K9/02 ,  H02K11/00 ,  H02K9/22

CPC classification number: H05K7/20909

Abstract: A motor controller and a cooling method thereof are provided. The motor controller includes: a first power module; a second power module; a first heat sink having first fins; a second heat sink having second fins; a first partition board; a second partition board; a housing disposed at external sides of the first and second partition boards, with a first channel formed between the housing and the first partition board; a conduit connected to a rear end of the first heat sink and extending to an outlet of the housing; a first flow channel; and a second flow channel passing through the first channel and the gaps of the second fins, for second cold air to be introduced, and processed by a heat exchange process performed by the second power module to generate second hot air that is expelled to the outlet of the housing through the second flow channel.

Abstract translation: 提供电机控制器及其冷却方法。 电机控制器包括：第一电源模块; 第二电源模块; 具有第一散热片的第一散热器; 具有第二散热片的第二散热器; 第一分隔板; 第二分隔板; 壳体，设置在第一和第二隔板的外侧，第一通道形成在壳体和第一隔板之间; 连接到第一散热器的后端并延伸到壳体的出口的导管; 第一流道; 以及通过所述第一通道和所述第二散热片的间隙的第二流动通道，用于要引入的第二冷空气，并且由所述第二电力模块执行的热交换过程进行处理，以产生排出到所述出口的第二热空气 的壳体通过第二流动通道。