公开(公告)号：US20140242318A1

公开(公告)日：2014-08-28

申请号：US13774104

申请日：2013-02-22

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Pei-Ju SU ,  Pao-Ming TSAI ,  Liang-You JIANG ,  Chyi-Ming LEU

IPC: B32B7/06

CPC classification number: B32B7/06 ,  C03C17/3405 ,  C03C2218/34 ,  C03C2218/355 ,  G09F3/02 ,  H05K1/0393 ,  Y10T428/1476

Abstract: A substrate structure applied in flexible devices is provided. The substrate structure includes a carrier; a release layer with a first area formed on the carrier, which has a first adhesion force to the carrier; and a flexible substrate with a second area overlying part of the first area of the release layer and contacting the carrier, which has a second adhesion force to the release layer and a third adhesion force to the carrier, wherein the first area is larger than or equal to the second area, the third adhesion force is greater than the first adhesion force, and the first adhesion force is greater than the second adhesion force.

Abstract translation: 提供了一种应用在柔性器件中的衬底结构。 衬底结构包括载体; 释放层，其具有形成在所述载体上的第一区域，所述第一区域对所述载体具有第一粘附力; 以及柔性基底，其具有覆盖在所述释放层的所述第一区域的一部分上的第二区域并使所述载体接触，所述载体对所述释放层具有第二粘附力和对所述载体的第三粘附力，其中所述第一区域大于或 等于第二区域，第三粘附力大于第一粘附力，并且第一粘附力大于第二粘附力。