公开(公告)号：US20140242318A1

公开(公告)日：2014-08-28

申请号：US13774104

申请日：2013-02-22

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Pei-Ju SU ,  Pao-Ming TSAI ,  Liang-You JIANG ,  Chyi-Ming LEU

IPC: B32B7/06

CPC classification number: B32B7/06 ,  C03C17/3405 ,  C03C2218/34 ,  C03C2218/355 ,  G09F3/02 ,  H05K1/0393 ,  Y10T428/1476

Abstract: A substrate structure applied in flexible devices is provided. The substrate structure includes a carrier; a release layer with a first area formed on the carrier, which has a first adhesion force to the carrier; and a flexible substrate with a second area overlying part of the first area of the release layer and contacting the carrier, which has a second adhesion force to the release layer and a third adhesion force to the carrier, wherein the first area is larger than or equal to the second area, the third adhesion force is greater than the first adhesion force, and the first adhesion force is greater than the second adhesion force.

Abstract translation: 提供了一种应用在柔性器件中的衬底结构。 衬底结构包括载体; 释放层，其具有形成在所述载体上的第一区域，所述第一区域对所述载体具有第一粘附力; 以及柔性基底，其具有覆盖在所述释放层的所述第一区域的一部分上的第二区域并使所述载体接触，所述载体对所述释放层具有第二粘附力和对所述载体的第三粘附力，其中所述第一区域大于或 等于第二区域，第三粘附力大于第一粘附力，并且第一粘附力大于第二粘附力。

公开(公告)号：US20150027642A1

公开(公告)日：2015-01-29

申请号：US14509837

申请日：2014-10-08

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Dong-Sen CHEN ,  Hsiao-Fen WEI ,  Liang-You JIANG ,  Yu-Yang CHANG

IPC: B32B43/00

CPC classification number: B32B43/006 ,  G02F1/133305 ,  G02F2001/13613 ,  Y10T156/1116

Abstract: Method for isolating a flexible film from a support substrate and method for fabricating an electronic device are provided. The method for isolating a flexible film from a support substrate includes providing a substrate with a top surface. A surface treatment is subjected to the top surface of the substrate, forming a top surface with detachment characteristics. A flexible film is formed on the top surface with detachment characteristics. The flexible film within the top surface with detachment characteristics is cut and isolated.

Abstract translation: 提供了从支撑基板分离柔性膜的方法和用于制造电子器件的方法。 从支撑衬底分离柔性膜的方法包括提供具有顶表面的衬底。 表面处理受到基板的顶表面的影响，形成具有脱离特性的顶面。 在顶表面上形成具有脱离特性的柔性膜。 切割和隔离具有脱离特性的顶表面内的柔性膜。