公开(公告)号：US20170150604A1

公开(公告)日：2017-05-25

申请号：US15356522

申请日：2016-11-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chen-Chu TSAI ,  Cheng-Yi WANG ,  Yuh-Zheng LEE ,  Ko-Chin YANG ,  Shi-Chang CHEN

IPC: H05K1/14 ,  H05K3/00 ,  H05K3/36 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/144 ,  G06F1/1643 ,  G06F1/1652 ,  H05K1/147 ,  H05K1/181 ,  H05K3/007 ,  H05K2201/058 ,  H05K2201/10128 ,  H05K2203/0228

Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.