公开(公告)号：US20170150604A1

公开(公告)日：2017-05-25

申请号：US15356522

申请日：2016-11-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chen-Chu TSAI ,  Cheng-Yi WANG ,  Yuh-Zheng LEE ,  Ko-Chin YANG ,  Shi-Chang CHEN

IPC: H05K1/14 ,  H05K3/00 ,  H05K3/36 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/144 ,  G06F1/1643 ,  G06F1/1652 ,  H05K1/147 ,  H05K1/181 ,  H05K3/007 ,  H05K2201/058 ,  H05K2201/10128 ,  H05K2203/0228

Abstract: A flexible electronic device includes a first flexible substrate, a first electronic component, a second flexible substrate, a second electronic component and an adhesive layer disposed between the first flexible substrate and the second flexible substrate. The first electronic component is disposed on a first surface of the first flexible substrate. The second electronic component is disposed on a first surface of the second flexible substrate. The first surface of the first flexible substrate has a first FPC bonding area having an orthogonal projection projected on a plane where the second flexible substrate is located does not overlap the second flexible substrate. The first surface of the second flexible substrate has a second FPC bonding area having an orthogonal projection projected on a plane where the first flexible substrate is located does not overlap the first flexible substrate.

公开(公告)号：US20160192478A1

公开(公告)日：2016-06-30

申请号：US14583235

申请日：2014-12-26

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Shu-Wei KUO ,  Kuo-Lung LO ,  Cheng-Che WU ,  Chen-Chu TSAI

IPC: H05K1/02

CPC classification number: H05K1/0281 ,  H05K1/189 ,  H05K3/007 ,  H05K3/284 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2201/2009 ,  H05K2203/1316

Abstract: According to embodiments of the disclosure, a flexible electronic device is provided. The flexible electronic device includes a flexible substrate, at least one component and at least one stress buffer. The component may be disposed on the flexible substrate and having a lateral surface. The stress buffer may be disposed adjacent to the lateral surface of the component and has a stiffness which is getting larger toward the component.

Abstract translation: 根据本公开的实施例，提供了一种灵活的电子设备。 柔性电子器件包括柔性衬底，至少一个部件和至少一个应力缓冲器。 该部件可以设置在柔性基板上并且具有侧面。 应力缓冲器可以布置成与部件的侧表面相邻，并且具有朝向部件越来越大的刚度。