公开(公告)号：US12200875B2

公开(公告)日：2025-01-14

申请号：US17277748

申请日：2019-09-20

Applicant: Industrial Technology Research Institute

Inventor： Yiu-Hsiang Chang ,  Jen-Chieh Lin ,  Prantik Mazumder ,  Scott Christopher Pollard ,  Pei-Lien Tseng

IPC: H05K3/42 ,  C23C18/16 ,  C25D7/00 ,  H05K1/03

Abstract: A method for metallizing through-glass vias in a glass substrate includes functionalizing a surface of the glass substrate with a silane. The glass substrate has an average thickness t and comprises a plurality of vias extending through the thickness t. The method further includes applying an electroless plating solution comprising a copper ion to deposit a copper seed layer on the functionalized surface, disposing an electrolyte within the plurality of vias, wherein the electrolyte comprises copper ions to be deposited on the copper seed layer within the plurality of vias; positioning an electrode within the electrolyte; and applying a current between the electrode and the glass substrate, thereby reducing the copper ions into copper within the plurality of vias such that each of the plurality of vias is filled with copper and the copper has a void volume fraction of less than 5%.

公开(公告)号：US20210360797A1

公开(公告)日：2021-11-18

申请号：US17277748

申请日：2019-09-20

Applicant: Industrial Technology Research Institute

Inventor： Yiu-Hsiang Chang ,  Jen-Chieh Lin ,  Prantik Mazumder ,  Scott Christopher Pollard ,  Pei-Lien Tseng

IPC: H05K3/42 ,  C23C18/16 ,  C25D7/00 ,  H05K1/03

Abstract: A method for metallizing through-glass vias in a glass substrate includes functionalizing a surface of the glass substrate with a silane. The glass substrate has an average thickness t and comprises a plurality of vias extending through the thickness t. The method further includes applying an electroless plating solution comprising a copper ion to deposit a copper seed layer on the functionalized surface, disposing an electrolyte within the plurality of vias, wherein the electrolyte comprises copper ions to be deposited on the copper seed layer within the plurality of vias; positioning an electrode within the electrolyte; and applying a current between the electrode and the glass substrate, thereby reducing the copper ions into copper within the plurality of vias such that each of the plurality of vias is filled with copper and the copper has a void volume fraction of less than 5%.

公开(公告)号：US20220177364A1

公开(公告)日：2022-06-09

申请号：US17199462

申请日：2021-03-12

Applicant: Industrial Technology Research Institute

Inventor： Yiu-Hsiang Chang ,  Wei-Yen Wang ,  Meng-Chi Huang

IPC: C03C17/36 ,  C23C18/38 ,  C23C18/12

Abstract: Provided are an adhesion promoting layer, a method for depositing a conductive layer on an inorganic or organic-inorganic hybrid substrate and a conductive structure. The adhesion promoting layer is suitable for depositing a conductive layer on an inorganic or organic-inorganic hybrid substrate, which includes a metal oxide layer and an interface layer. The metal oxide layer is disposed on the inorganic or organic-inorganic hybrid substrate. The interface layer is disposed between the metal oxide layer and the inorganic or organic-inorganic hybrid substrate. The metal oxide layer includes metal oxide and a chelating agent. The interface layer includes the metal oxide, the chelating agent and metal-nonmetal-oxide composite material.

公开(公告)号：US10416114B2

公开(公告)日：2019-09-17

申请号：US15352242

申请日：2016-11-15

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jui-Chin Chen ,  Pei-Jer Tzeng ,  Tzu-Kun Ku ,  Yu-Chen Hsin ,  Yiu-Hsiang Chang

IPC: G01N27/403 ,  G01N27/417 ,  G01N33/483 ,  G01N33/487 ,  G01N27/27 ,  G01N27/327

Abstract: A structure of an electrochemical unit includes a substrate, a first metal layer disposed on the substrate, and an array of electrochemical cells disposed on the first metal layer. The array of the electrochemical cells includes a plurality of electrochemical cells. Each of the electrochemical cells includes the first metal layer disposed on the substrate, a first electrode disposed on the first metal layer, a polymer layer disposed on the substrate and adjacent to the first metal layer and the first electrode. A second metal layer is disposed on the polymer layer, and a second electrode is disposed on the second metal layer. A pore is constituted between the polymer layers of every the two electrochemical cells. A cavity located above the first electrode is defined between every the two electrochemical cells, wherein the cavity is communicated with the pore.