公开(公告)号：US09303327B2

公开(公告)日：2016-04-05

申请号：US13738833

申请日：2013-01-10

Applicant: Infineon Technologies AG

Inventor： Sung Hoe Yeong ,  Lay Yeap Lim ,  Tien Shyang Law

IPC: H05K1/18 ,  C25D13/12 ,  H01L23/29 ,  H01L21/56 ,  H01L23/31

CPC classification number: C25D13/12 ,  C08K2003/2227 ,  C08K2003/385 ,  C09D5/4411 ,  C09D5/4457 ,  C09D7/61 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system, a packaged component and a method for making a packaged component are disclosed. In an embodiment a system comprises a component carrier, a component disposed on the component carrier and an insulating layer disposed on an electrically conductive surface of at least one of the component carrier or the component, wherein the insulating layer comprises a polymer and an inorganic material comprising a dielectric strength of equal or greater than 15 ac-kv/mm and a thermal conductivity of equal or greater than 15 W/m*K.

Abstract translation: 公开了一种系统，封装元件和制造封装元件的方法。 在一个实施例中，系统包括部件载体，设置在部件载体上的部件和设置在部件载体或部件中的至少一个的导电表面上的绝缘层，其中绝缘层包括聚合物和无机材料 包括等于或大于15ac-kv / mm的介电强度和等于或大于15W / m * K的热导率。

公开(公告)号：US20230178428A1

公开(公告)日：2023-06-08

申请号：US17543199

申请日：2021-12-06

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Fee Hoon Wendy Wong ,  Thomas Behrens ,  Eric Lopez Bonifacio ,  Chau Fatt Chiang ,  Irmgard Escher-Poeppel ,  Giovanni Ragasa Garbin ,  Martin Gruber ,  Tien Shyang Law ,  Mohamad Azian Mohamed Azizi ,  Si Hao Vincent Yeo

IPC: H01L21/768 ,  H01L21/56 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L21/76838 ,  H01L21/563 ,  H01L23/31 ,  H01L21/4839

Abstract: A method includes providing a lead frame with a central metal plate and a plurality of leads extending away from the central metal plate, the central metal plate including an upper surface that includes a first mesa that is elevated from recessed regions, mounting a semiconductor die on the upper surface of central metal plate such that a lower surface of the semiconductor die is at least partially disposed on the first mesa, forming electrical interconnections between terminals of the semiconductor die and the leads, forming an encapsulant body on the central metal plate such that the semiconductor die is encapsulated by the encapsulant body and such that the leads protrude out from edge sides of the encapsulant body, and thinning the central metal plate from a rear surface of the central metal plate so as to isolate the first mesa at a lower surface of the encapsulant body.

公开(公告)号：US20140192500A1

公开(公告)日：2014-07-10

申请号：US13738833

申请日：2013-01-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Sung Hoe Yeong ,  Lay Yeap Lim ,  Tien Shyang Law

IPC: C25D13/12 ,  H01L23/29

CPC classification number: C25D13/12 ,  C08K2003/2227 ,  C08K2003/385 ,  C09D5/4411 ,  C09D5/4457 ,  C09D7/61 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system, a packaged component and a method for making a packaged component are disclosed. In an embodiment a system comprises a component carrier, a component disposed on the component carrier and an insulating layer disposed on an electrically conductive surface of at least one of the component carrier or the component, wherein the insulating layer comprises a polymer and an inorganic material comprising a dielectric strength of equal or greater than 15 ac-kv/mm and a thermal conductivity of equal or greater than 15 W/m*K.

Abstract translation: 公开了一种系统，封装元件和制造封装元件的方法。 在一个实施例中，系统包括部件载体，设置在部件载体上的部件和设置在部件载体或部件中的至少一个的导电表面上的绝缘层，其中绝缘层包括聚合物和无机材料 包括等于或大于15ac-kv / mm的介电强度和等于或大于15W / m * K的热导率。