公开(公告)号：US09303327B2

公开(公告)日：2016-04-05

申请号：US13738833

申请日：2013-01-10

Applicant: Infineon Technologies AG

Inventor： Sung Hoe Yeong ,  Lay Yeap Lim ,  Tien Shyang Law

IPC: H05K1/18 ,  C25D13/12 ,  H01L23/29 ,  H01L21/56 ,  H01L23/31

CPC classification number: C25D13/12 ,  C08K2003/2227 ,  C08K2003/385 ,  C09D5/4411 ,  C09D5/4457 ,  C09D7/61 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system, a packaged component and a method for making a packaged component are disclosed. In an embodiment a system comprises a component carrier, a component disposed on the component carrier and an insulating layer disposed on an electrically conductive surface of at least one of the component carrier or the component, wherein the insulating layer comprises a polymer and an inorganic material comprising a dielectric strength of equal or greater than 15 ac-kv/mm and a thermal conductivity of equal or greater than 15 W/m*K.

Abstract translation: 公开了一种系统，封装元件和制造封装元件的方法。 在一个实施例中，系统包括部件载体，设置在部件载体上的部件和设置在部件载体或部件中的至少一个的导电表面上的绝缘层，其中绝缘层包括聚合物和无机材料 包括等于或大于15ac-kv / mm的介电强度和等于或大于15W / m * K的热导率。

公开(公告)号：US20250096082A1

公开(公告)日：2025-03-20

申请号：US18369443

申请日：2023-09-18

Applicant: Infineon Technologies AG

Inventor： Mei Yih Goh ,  Chee Voon Tan ,  Sung Hoe Yeong ,  Michael Stadler

IPC: H01L23/495 ,  H01L23/00 ,  H01L25/07

Abstract: An electrical interconnect clip includes a die interface portion that is adapted for mating in between two vertically stacked semiconductor dies, and a carrier connection portion that is configured to electrically connect the two vertically stacked semiconductor dies with a carrier, wherein the die interface portion comprises a lower mating surface, an upper mating surface opposite from the lower mating surface, and a solder retention feature formed by one or more grooves in the upper mating surface that are spaced apart from the outer edge sides of the electrical interconnect clip and surround a die attach area of the upper mating surface.

公开(公告)号：US20140192500A1

公开(公告)日：2014-07-10

申请号：US13738833

申请日：2013-01-10

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Sung Hoe Yeong ,  Lay Yeap Lim ,  Tien Shyang Law

IPC: C25D13/12 ,  H01L23/29

CPC classification number: C25D13/12 ,  C08K2003/2227 ,  C08K2003/385 ,  C09D5/4411 ,  C09D5/4457 ,  C09D7/61 ,  H01L21/56 ,  H01L23/29 ,  H01L23/3157 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A system, a packaged component and a method for making a packaged component are disclosed. In an embodiment a system comprises a component carrier, a component disposed on the component carrier and an insulating layer disposed on an electrically conductive surface of at least one of the component carrier or the component, wherein the insulating layer comprises a polymer and an inorganic material comprising a dielectric strength of equal or greater than 15 ac-kv/mm and a thermal conductivity of equal or greater than 15 W/m*K.

Abstract translation: 公开了一种系统，封装元件和制造封装元件的方法。 在一个实施例中，系统包括部件载体，设置在部件载体上的部件和设置在部件载体或部件中的至少一个的导电表面上的绝缘层，其中绝缘层包括聚合物和无机材料 包括等于或大于15ac-kv / mm的介电强度和等于或大于15W / m * K的热导率。