公开(公告)号：US20190281717A1

公开(公告)日：2019-09-12

申请号：US16335050

申请日：2016-09-28

Applicant: INTEL CORPORATION

Inventor： Aleksandar Aleksov ,  Son V. Nguyen ,  Rajat Goyal ,  David B. Lampner ,  Dilan Seneviratne ,  Albert S. Lopez ,  Joshua D. Heppner ,  Srinivas V. Pietambaram ,  Shawna M. Liff ,  Nadine L. Dabby

IPC: H05K5/06 ,  H05K5/00 ,  H05K5/02

Abstract: The document discloses a stretchable packaging system for a wearable electronic device. The system includes a first electronic component and a flexible trace connected to the first electronic component. An elastomer layer having a variable thickness at least partially encapsulates the first electronic component and the flexible trace. A first region of the layer has a first thickness that is greater than a second thickness of a second region of the layer that at least partially encapsulates the trace.

公开(公告)号：US10820437B2

公开(公告)日：2020-10-27

申请号：US16335050

申请日：2016-09-28

Applicant: Intel Corporation

Inventor： Aleksandar Aleksov ,  Son V. Nguyen ,  Rajat Goyal ,  David B. Lampner ,  Dilan Seneviratne ,  Albert S. Lopez ,  Joshua D. Heppner ,  Srinivas V. Pietambaram ,  Shawna M. Liff ,  Nadine L. Dabby

IPC: G06F17/30 ,  H05K5/06 ,  H05K5/00 ,  H05K5/02 ,  G06F1/18 ,  G06F1/16 ,  G04G17/04

Abstract: The document discloses a stretchable packaging system for a wearable electronic device. The system includes a first electronic component and a flexible trace connected to the first electronic component. An elastomer layer having a variable thickness at least partially encapsulates the first electronic component and the flexible trace. A first region of the layer has a first thickness that is greater than a second thickness of a second region of the layer that at least partially encapsulates the trace.