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公开(公告)号:US20190281717A1
公开(公告)日:2019-09-12
申请号:US16335050
申请日:2016-09-28
Applicant: INTEL CORPORATION
Inventor: Aleksandar Aleksov , Son V. Nguyen , Rajat Goyal , David B. Lampner , Dilan Seneviratne , Albert S. Lopez , Joshua D. Heppner , Srinivas V. Pietambaram , Shawna M. Liff , Nadine L. Dabby
Abstract: The document discloses a stretchable packaging system for a wearable electronic device. The system includes a first electronic component and a flexible trace connected to the first electronic component. An elastomer layer having a variable thickness at least partially encapsulates the first electronic component and the flexible trace. A first region of the layer has a first thickness that is greater than a second thickness of a second region of the layer that at least partially encapsulates the trace.
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公开(公告)号:US10798817B2
公开(公告)日:2020-10-06
申请号:US15780327
申请日:2015-12-11
Applicant: Intel Corporation
Inventor: Aleksandar Aleksov , Javier Soto Gonzalez , Meizi Jiao , Shruti R. Jaywant , Oscar Ojeda , Sashi S. Kandanur , Srinivas Venkata Ramanuja Pietambaram , Roy Dittler , Rajat Goyal , Dilan Seneviratne
IPC: H05K1/02 , H05K3/46 , H01L23/538 , H01L21/48 , H05K1/11 , H05K1/18 , H05K3/06 , H05K3/30 , H05K3/40 , H05K3/28
Abstract: Apparatus and methods are provided for flexible and stretchable circuits. In an example, a method can include forming a first flexible conductor on a substrate, the first flexible conductor including a first conductive trace surrounded on three sides by a first dielectric, and forming a second flexible conductor on top of the first flexible conductor, the first flexible conductor located between the second flexible conductor and the substrate, the second flexible conductor including a second conductive trace surrounded by a second dielectric.
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公开(公告)号:US20180376585A1
公开(公告)日:2018-12-27
申请号:US15780327
申请日:2015-12-11
Applicant: Intel Corporation
Inventor: Aleksandar Aleksov , Javier Soto Gonzalea , Meizi Jiao , Shruti R. Jaywant , Oscar Ojeda , Sashi S. Kandanur , Srinivas Pietambaram , Roy Dittler , Rajat Goyal , Dilan Seneviratne
CPC classification number: H05K1/0283 , H01L21/4857 , H01L23/5383 , H01L23/5386 , H01L23/5387 , H05K1/115 , H05K1/189 , H05K3/064 , H05K3/284 , H05K3/303 , H05K3/4053 , H05K3/4682 , H05K2201/0133 , H05K2201/09263 , H05K2203/043
Abstract: Apparatus and methods are provided for flexible and stretchable circuits. In an example, a method can include forming a first flexible conductor on a substrate, the first flexible conductor including a first conductive trace surrounded on three sides by a first dielectric, and forming a second flexible conductor on top of the first flexible conductor, the first flexible conductor located between the second flexible conductor and the substrate, the second flexible conductor including a second conductive trace surrounded by a second dielectric.
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公开(公告)号:US20180295720A1
公开(公告)日:2018-10-11
申请号:US15762791
申请日:2015-09-24
Applicant: Intel Corporation
Inventor: Aleksandar Aleksov , Adel A. Elsherbini , Javier Soto Gonzalez , Dilan Seneviratne , Shruti R. Jaywant , Sashi S. Kandanur , Srinivas Pietambaram , Nadine L. Dabby , Braxton Lathrop , Rajat Goyal , Vivek Raghunathan
IPC: H05K1/02 , H05K1/18 , H05K1/11 , H05K1/03 , H05K3/18 , H05K3/46 , H05K3/00 , H05K3/34 , H05K3/28 , H05K3/42
CPC classification number: H05K1/0283 , H01L23/145 , H01L23/5387 , H05K1/038 , H05K1/111 , H05K1/189 , H05K3/0023 , H05K3/0047 , H05K3/0052 , H05K3/0055 , H05K3/18 , H05K3/205 , H05K3/284 , H05K3/341 , H05K3/429 , H05K3/4661 , H05K3/4682 , H05K2201/0133 , H05K2201/0329 , H05K2201/09263 , H05K2201/10098 , H05K2201/10151 , H05K2203/1316 , H05K2203/1327
Abstract: Some forms relate to an example stretchable electronic assembly. The stretchable electronic assembly includes a stretchable body that includes electronic components. A plurality of meandering conductors electrically connect the electronic components. The plurality of meandering conductors may be exposed from the stretchable body. A plurality of conductive pads are electrically connected to at least one of the electronic components or some of the plurality of meandering conductors. The plurality of conductive pads may be exposed from the stretchable body. The stretchable body includes an upper surface and lower surface. The plurality of meandering conductors may be exposed from the lower surface (in addition to, or alternatively to, the upper surface) of the stretchable body.
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公开(公告)号:US10820437B2
公开(公告)日:2020-10-27
申请号:US16335050
申请日:2016-09-28
Applicant: Intel Corporation
Inventor: Aleksandar Aleksov , Son V. Nguyen , Rajat Goyal , David B. Lampner , Dilan Seneviratne , Albert S. Lopez , Joshua D. Heppner , Srinivas V. Pietambaram , Shawna M. Liff , Nadine L. Dabby
Abstract: The document discloses a stretchable packaging system for a wearable electronic device. The system includes a first electronic component and a flexible trace connected to the first electronic component. An elastomer layer having a variable thickness at least partially encapsulates the first electronic component and the flexible trace. A first region of the layer has a first thickness that is greater than a second thickness of a second region of the layer that at least partially encapsulates the trace.
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公开(公告)号:US10327330B2
公开(公告)日:2019-06-18
申请号:US15762791
申请日:2015-09-24
Applicant: Intel Corporation
Inventor: Aleksandar Aleksov , Adel A. Elsherbini , Javier Soto Gonzalez , Dilan Seneviratne , Shruti R. Jaywant , Sashi S. Kandanur , Srinivas Pietambaram , Nadine L. Dabby , Braxton Lathrop , Rajat Goyal , Vivek Raghunathan
IPC: H05K1/02 , H01L23/14 , H01L23/538 , H05K1/03 , H05K1/11 , H05K1/18 , H05K3/00 , H05K3/18 , H05K3/28 , H05K3/34 , H05K3/42 , H05K3/46 , H05K3/20
Abstract: Some forms relate to an example stretchable electronic assembly. The stretchable electronic assembly includes a stretchable body that includes electronic components. A plurality of meandering conductors electrically connect the electronic components. The plurality of meandering conductors may be exposed from the stretchable body. A plurality of conductive pads are electrically connected to at least one of the electronic components or some of the plurality of meandering conductors. The plurality of conductive pads may be exposed from the stretchable body. The stretchable body includes an upper surface and lower surface. The plurality of meandering conductors may be exposed from the lower surface (in addition to, or alternatively to, the upper surface) of the stretchable body.
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