公开(公告)号：US09250406B2

公开(公告)日：2016-02-02

申请号：US13722951

申请日：2012-12-20

Applicant: INTEL CORPORATION

Inventor： Peter L. D. Chang ,  Edris M. Mohammed ,  Henning Braunisch ,  Hengju Cheng

IPC: G02B6/12 ,  G02B6/43

CPC classification number: G02B6/43 ,  H01L2224/73204 ,  Y10T29/49117 ,  Y10T29/4913

Abstract: Embodiments of the present disclosure provide techniques and configurations for routing signals of an electro-optical assembly using a glass bridge. In one embodiment, an electro-optical assembly includes a laser die having a laser device and a glass bridge electrically coupled with the laser die by one or more interconnect structures, the glass bridge including electrical routing features configured to route electrical signals to the laser die from a transmitter device. Other embodiments may be described and/or claimed.

Abstract translation: 本公开的实施例提供了使用玻璃桥路由电光学组件路由信号的技术和配置。 在一个实施例中，电光学组件包括具有激光器件的激光器管芯和通过一个或多个互连结构与激光管芯电耦合的玻璃桥，所述玻璃桥接器包括被配置为将电信号路由到激光器管芯 从发射机设备。 可以描述和/或要求保护其他实施例。

公开(公告)号：US09664858B2

公开(公告)日：2017-05-30

申请号：US13721965

申请日：2012-12-20

Applicant: Intel Corporation

Inventor： Edris M. Mohammed ,  Peter L. Chang ,  Ibrahim Ban

IPC: G02B6/36 ,  G02B6/122 ,  G02B6/42 ,  G02B6/12 ,  G02B6/132 ,  G02B6/32

CPC classification number: G02B6/36 ,  G02B6/12002 ,  G02B6/12004 ,  G02B6/1228 ,  G02B6/132 ,  G02B6/32 ,  G02B6/4214 ,  G02B2006/12176 ,  G02B2006/12195

Abstract: Systems and methods may couple on-chip optical circuits to external fibers. An SOI waveguide structure may include mirror structures and tapered waveguides to optically couple optical circuits to fibers in a vertically oriented external connector. The mirror structure(s) may be angularly disposed at the ends of the silicon waveguide structure. An oxide layer may cover a buried oxide layer and the silicon waveguide structure. The tapered waveguide(s) may have a narrow end and a wide end. The narrow end of the tapered waveguide(s) may be disposed above the mirror structures. The tapered waveguide(s) may extend through the oxide layer from the narrow end in a direction perpendicular to the silicon waveguide structure. An external connector may fit over the tapered waveguide(s) and uses a fiber array traveling through a connector body to optically couple to the external fiber.

公开(公告)号：US09618824B2

公开(公告)日：2017-04-11

申请号：US14499115

申请日：2014-09-27

Applicant: Intel Corporation

Inventor： Edris M. Mohammed ,  Ibrahim Ban

IPC: G02F1/35 ,  H01L31/14 ,  G01V8/00

CPC classification number: G02F1/353 ,  A61B5/1135 ,  A61B5/14532 ,  G01N21/3586 ,  G01N2021/1793 ,  G01V8/005 ,  G02F2203/13 ,  H01L31/14

Abstract: Systems and methods may provide for an integrated miniature sensor that operates in the Terahertz region of the electromagnetic spectrum. The integrated miniature sensor may detect a remote target and operate in a non-contact, non-invasive manner. Numerous signal analysis techniques may be employed such as Doppler radar technology, absorption spectroscopy, and others when the integrated miniature sensor is used in biomedical, physiological and other settings where prolonged recording of bio-signals is needed.