公开(公告)号：US09551177B2

公开(公告)日：2017-01-24

申请号：US14141196

申请日：2013-12-26

Applicant: INTEL CORPORATION

Inventor： Krishnakumar Varadarajan ,  Harish Jagadish ,  Anand V. Reddy ,  Madhukar Patil ,  James Panakkal ,  Guru Prakash

IPC: E05D11/10 ,  G06F1/16

CPC classification number: E05D11/1007 ,  G06F1/1679 ,  G06F1/1681 ,  Y10T16/54025 ,  Y10T29/24

Abstract: Techniques related to a hinge in a computing device are described herein. The techniques may include forming a shaft to move rotationally, and forming a sliding component to move translationally as a result of rotational movement of the shaft.

Abstract translation: 本文描述了与计算设备中的铰链相关的技术。 这些技术可以包括形成轴以便旋转地移动，以及形成由于轴的旋转运动而平滑运动的滑动部件。

公开(公告)号：USD945993S1

公开(公告)日：2022-03-15

申请号：US29649341

申请日：2018-05-29

Applicant: Intel Corporation

Designer： Naveen Kumar ,  James Panakkal ,  Suresh V. Subramanyam

公开(公告)号：US20210153340A1

公开(公告)日：2021-05-20

申请号：US17127407

申请日：2020-12-18

Applicant: Intel Corporation

Inventor： Jaejin Lee ,  James Panakkal ,  Min Suet Lim ,  Aiswarya M. Pious

IPC: H05K1/02 ,  H05K9/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.

公开(公告)号：US12167530B2

公开(公告)日：2024-12-10

申请号：US17127407

申请日：2020-12-18

Applicant: Intel Corporation

Inventor： Jaejin Lee ,  James Panakkal ,  Min Suet Lim ,  Aiswarya M. Pious

IPC: H05K1/02 ,  H05K9/00

Abstract: Embodiments described herein may be related to apparatuses, processes, and techniques related to EMI shielding and thermal conduction without using any surface area of a PCB. Embodiments of the EMI shield may include a planar top, with one or more walls extending from the planar top to a bottom surface of the PCB, the PCB having a top surface disposed between the bottom surface of the PCB and the planar top. A ground of the PCB may electrically couple with the one or more walls. The bottom of the walls may couple with an EMI gasket applied to a bottom chassis to increase the volume of EMI shielding. Other embodiments may be described and/or claimed.