公开(公告)号：US11923268B2

公开(公告)日：2024-03-05

申请号：US16781475

申请日：2020-02-04

申请人： INTEL CORPORATION

发明人： Jesus Gerardo Reyes Schuldes ,  Shankar Devasenathipathy ,  Pramod Malatkar ,  Aravindha Antoniswamy ,  Kyle Arrington

IPC分类号： H01L23/367 ,  H01L21/48 ,  H01L23/00 ,  H01L23/373 ,  H05K1/02

CPC分类号： H01L23/3675 ,  H01L21/4814 ,  H01L23/373 ,  H01L24/16 ,  H01L24/73 ,  H05K1/0204 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/1532

摘要： Techniques and mechanisms for promoting heat conduction in a packaged device using a heat spreader that is fabricated by a build-up process. In an embodiment, 3D printing of a heat spreader successively deposit layers of a thermal conductor material, where said layers variously extend each over a respective one or more IC dies. The heat spreader forms a flat top side, wherein a bottom side of the heat spreader extends over, and conforms at least partially to, different respective heights of various IC dies. In another embodiment, fabrication of a portion of the heat spreader comprises printing pore structures that contribute to a relatively low thermal conductivity of said portion. An average orientation of the oblong pores contributes to different respective thermal conduction properties for various directions of heat flow.

公开(公告)号：US20210242105A1

公开(公告)日：2021-08-05

申请号：US16781475

申请日：2020-02-04

申请人： INTEL CORPORATION

发明人： Jesus Gerardo Reyes Schuldes ,  Shankar Devasenathipathy ,  Pramod Malatkar ,  Aravindha Antoniswamy ,  Kyle Arrington

IPC分类号： H01L23/367 ,  H01L23/373 ,  H01L21/48 ,  H01L23/00 ,  H05K1/02

摘要： Techniques and mechanisms for promoting heat conduction in a packaged device using a heat spreader that is fabricated by a build-up process. In an embodiment, 3D printing of a heat spreader successively deposit layers of a thermal conductor material, where said layers variously extend each over a respective one or more IC dies. The heat spreader forms a flat top side, wherein a bottom side of the heat spreader extends over, and conforms at least partially to, different respective heights of various IC dies. In another embodiment, fabrication of a portion of the heat spreader comprises printing pore structures that contribute to a relatively low thermal conductivity of said portion. An average orientation of the oblong pores contributes to different respective thermal conduction properties for various directions of heat flow.