公开(公告)号：US20170098594A1

公开(公告)日：2017-04-06

申请号：US15384222

申请日：2016-12-19

Applicant: Intel Corporation

Inventor： FERAS EID ,  Jessica GULLBRAND ,  Melissa A. COWAN

IPC: H01L23/467 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683

CPC classification number: H01L23/467 ,  B05B17/0653 ,  B81C1/00238 ,  F04D33/00 ,  F15D1/008 ,  F15D1/08 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/49838 ,  H01L2221/68345 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/10378

Abstract: Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.

公开(公告)号：US20170098593A1

公开(公告)日：2017-04-06

申请号：US15384158

申请日：2016-12-19

Applicant: Intel Corporation

Inventor： Feras EID ,  Jessica GULLBRAND ,  Melissa A. COWAN

IPC: H01L23/467 ,  H05K1/18 ,  H05K1/02

CPC classification number: H01L23/467 ,  B05B17/0653 ,  B81C1/00238 ,  F04D33/00 ,  F15D1/008 ,  F15D1/08 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/49838 ,  H01L2221/68345 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/10378

Abstract: Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.

公开(公告)号：US20160358841A1

公开(公告)日：2016-12-08

申请号：US14728705

申请日：2015-06-02

Applicant: INTEL CORPORATION

Inventor： Feras EID ,  Jessica GULLBRAND ,  Melissa A. COWAN

IPC: H01L23/467 ,  B05B17/06 ,  H01L21/683 ,  H05K1/18 ,  H05K1/02 ,  H01L21/48 ,  F15D1/00 ,  H01L23/498

CPC classification number: H01L23/467 ,  B05B17/0653 ,  B81C1/00238 ,  F04D33/00 ,  F15D1/008 ,  F15D1/08 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/49838 ,  H01L2221/68345 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/10378

Abstract: Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.

Abstract translation: 实施例包括形成在封装衬底的层内的合成喷射装置，以便提供用于感测或冷却应用的受控气流。 喷射装置包括在顶部和底部空腔之间的导电材料的电磁驱动振动膜。 具有开口的顶盖覆盖顶部空腔，并且永久磁铁位于底部空腔下方。 通过膜传导的交流信号导致膜在由永磁体引起的磁场的存在下振动。 通过用封装成形工艺制造，与使用硅芯片或晶片加工相比，射流（1）的成本更高， （2）容易地集成为封装衬底的其他层的一部分并与其一起; 和（3）可以由安装在包装上的芯片驱动。 实施例还包括具有用于形成射流的方法和方法。