公开(公告)号：US20230246338A1

公开(公告)日：2023-08-03

申请号：US18133361

申请日：2023-04-11

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q19/22

CPC classification number: H01Q9/0414 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/49541 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/2283 ,  H01Q1/241 ,  H01Q1/526 ,  H01Q19/22 ,  H01L23/3675

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20210265732A1

公开(公告)日：2021-08-26

申请号：US17317332

申请日：2021-05-11

Applicant: Intel Corporation

Inventor： Feras EID ,  Sasha N. OSTER ,  Telesphor KAMGAING ,  Georgios C. DOGIAMIS ,  Aleksandar ALEKSOV

IPC: H01Q9/04 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495 ,  H01L23/552 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q19/22

Abstract: Embodiments of the invention include a microelectronic device that includes a first substrate having radio frequency (RF) components and a second substrate that is coupled to the first substrate. The second substrate includes a first conductive layer of an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher. A mold material is disposed on the first and second substrates. The mold material includes a first region that is positioned between the first conductive layer and a second conductive layer of the antenna unit with the mold material being a dielectric material to capacitively couple the first and second conductive layers of the antenna unit.

公开(公告)号：US20200219861A1

公开(公告)日：2020-07-09

申请号：US16647451

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Vijay K. NAIR ,  Feras EID ,  Georgios C. DOGIAMIS ,  Johanna M. SWAN ,  Stephan LEUSCHNER

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/24 ,  H03H9/17 ,  H03H9/05

Abstract: RF front end systems or modules with an acoustic wave resonator (AWR) on an interposer substrate are described. In an example, an integrated system includes an active die, the active die comprising a semiconductor substrate having a plurality of active circuits therein. An interposer is also included, the interposer comprising an acoustic wave resonator (AWR). A seal frame couples the active die to the interposer, the seal frame surrounding the acoustic wave resonator and hermetically sealing the acoustic wave resonator between the active die and the interposer.

公开(公告)号：US20200168402A1

公开(公告)日：2020-05-28

申请号：US16605968

申请日：2017-06-27

Applicant: Intel Corporation

Inventor： Feras EID ,  Aleksandar ALEKSOV ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H01G5/16 ,  H01G5/14 ,  H01L23/00

Abstract: Embodiments of the invention include a microelectronic device that includes a plurality of organic dielectric layers and a piezoelectrically actuated tunable capacitor having a variable capacitance formed in-situ with at least one organic dielectric layer of the plurality of organic dielectric layers. A piezoelectric actuator of the tunable capacitor includes first and second conductive electrodes and a piezoelectric layer that is positioned between the first and second conductive electrodes.

公开(公告)号：US20200060558A1

公开(公告)日：2020-02-27

申请号：US16304070

申请日：2016-07-02

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Feras EID ,  Sasha N. OSTER ,  Adel ELSHERBINI ,  Johanna M. SWAN

IPC: A61B5/021 ,  A61B5/0408 ,  A61B5/00 ,  A61B5/11 ,  H01L41/08 ,  H01L41/316 ,  H01L41/317

Abstract: Embodiments of the invention include a wearable blood-pressure monitor and methods of forming such devices. In an embodiment, the blood-pressure monitor includes a stretchable substrate. Additionally, a semiconductor die may be embedded within the stretchable substrate. In order to determine blood-pressure, the blood-pressure monitor may include an electrocardiogram sensor and a piezoelectric sensor for detecting a ballistocardiograph response. In an embodiment, both types of sensor may be electrically coupled to the semiconductor die. Embodiments of the invention include a piezoelectric sensor that includes a piezoelectric layer and a first and second electrode. In an embodiment the first electrode is in contact with a first surface of the piezoelectric layer, and the second electrode is in contact with a second surface of the piezoelectric layer that is opposite to the first surface.

公开(公告)号：US20190214338A1

公开(公告)日：2019-07-11

申请号：US16328231

申请日：2016-09-14

Applicant: Intel Corporation

Inventor： Eng Huat GOH ,  Jiun Hann SIR ,  Min Suet LIM ,  Shawna M. LIFF ,  Feras EID

IPC: H01L23/498 ,  H01L23/538 ,  H01L23/552 ,  H01L23/00

CPC classification number: H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/00 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/5383 ,  H01L23/552 ,  H01L23/562

Abstract: Semiconductor packages that mitigate warpage and/or other types or mechanical deformation of package substrates are provided. In some embodiments, a package substrate can include a peripheral conductive region having an assembly of rigid conductive members, such as metal layers, metal interconnects, or a combination thereof. The peripheral conductive region can be integrated into the package substrate during the manufacturing of the package substrate. In some implementations, lithographically defined conductive members can be leveraged to form extended conductive layers that can provide increased stiffness compared to nearly cylindrical conductive vias. Non-peripheral conductive regions also can be integrated into a semiconductor package in order to reduce specific patterns of mechanical deformations and/or to provide other functionality, such as electromagnetic interference (EMI) shielding.

公开(公告)号：US20190025573A1

公开(公告)日：2019-01-24

申请号：US16072164

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Feras EID ,  Sasha N. OSTER ,  Shawna M. LIFF ,  Johanna M. SWAN ,  Thomas L. SOUNART ,  Baris BICEN ,  Valluri R. RAO

IPC: G02B26/10 ,  G02B26/08

Abstract: Embodiments of the invention include maskless imaging tools and display systems that include piezoelectrically actuated mirrors and methods of forming such devices. According to an embodiment, the maskless imaging tool may include a light source. Additionally, the tool may include one or more piezoelectrically actuated mirrors for receiving light from the light source. In an embodiment, the piezoelectrically actuated mirrors are actuatable about one or more axes to reflect the light from the light source to a workpiece positioned to receive light from the piezoelectrically actuated mirror. Additional embodiments of the invention may include a maskless imaging tool that is a laser direct imaging lithography (LDIL) tool. Other embodiments may include a maskless imaging tool that is a via-drill tool. Embodiments of the invention may also include a piezoelectrically actuated mirror used in a projection system. For example, the projection system may be integrated into a pair of glasses.

公开(公告)号：US20180310399A1

公开(公告)日：2018-10-25

申请号：US15771833

申请日：2015-12-21

Applicant: Intel Corporation

Inventor： Vijay K. NAIR ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Telesphor KAMGAING ,  Feras EID

IPC: H05K1/02 ,  H01P3/12 ,  H01P5/107 ,  H05K3/46

CPC classification number: H05K1/0243 ,  H01P3/121 ,  H01P5/107 ,  H05K3/4697 ,  H05K2201/037 ,  H05K2201/09618

Abstract: Embodiments of the invention include a waveguide structure that includes a lower member, at least one sidewall member coupled to the lower member, and an upper member. The lower member, the at least one sidewall member, and the upper member include at least one conductive layer to form a cavity in a substrate for allowing communications between devices that are coupled or attached to the substrate.

公开(公告)号：US20180097284A1

公开(公告)日：2018-04-05

申请号：US15283140

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Shawna M. LIFF ,  Adel A. ELSHERBINI ,  Sasha N. OSTER ,  Feras EID ,  Georgios C. DOGIAMIS ,  Thomas L. SOUNART ,  Johanna M. SWAN

IPC: H01Q1/52 ,  H01L41/09 ,  H01L41/047 ,  H01L41/187 ,  H01L41/04 ,  H01Q5/50 ,  H04L29/06

CPC classification number: H01Q1/526 ,  H01L41/047 ,  H01L41/094 ,  H01Q1/273 ,  H01Q15/0086 ,  H04L63/0245 ,  H04L63/1475 ,  H04L67/12 ,  H04L67/146 ,  H04W12/0052 ,  H04W12/12

Abstract: Embodiments of the invention include a reconfigurable communication system, that includes a substrate and a metamaterial shield formed over the substrate. In an embodiment, the metamaterial shield surrounds one or more components on the substrate. Additionally, a plurality of first piezoelectric actuators may be formed on the substrate. The first piezoelectric actuators may be configured to deform the metamaterial shield and change a frequency band that is permitted to pass through the metamaterial shield. Embodiments may also include a reconfigurable antenna that includes a metamaterial. In an embodiment, a plurality of second piezoelectric actuators may be configured to deform the metamaterial of the antenna and change a central operating frequency of the antenna. Embodiments may also include an integrated circuit electrically coupled to the plurality of first piezoelectric actuators and second piezoelectric actuators.

公开(公告)号：US20180003749A1

公开(公告)日：2018-01-04

申请号：US15201144

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Feras EID ,  Ian A. YOUNG

IPC: G01R23/02

CPC classification number: G01R23/02 ,  G01D5/00 ,  G01D18/006 ,  G01P15/097 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00014

Abstract: Embodiments of the invention include a resonant sensing system comprising driving circuitry to generate a drive signal during excitation time periods, a first switch coupled to the driving circuitry, and a sensing device coupled to the driving circuitry via the first switch during the excitation time periods. The sensing device includes beams to receive the drive signal during a first excitation time period that causes the beams to mechanically oscillate and generate a first induced electromotive force (emf) in response to the drive signal. The first switch decouples the sensing device and the driving circuitry during measurement time periods for measurement of the induced emf.