公开(公告)号：US20230309262A1

公开(公告)日：2023-09-28

申请号：US18203904

申请日：2023-05-31

Applicant: Intel Corporation

Inventor： Liguang DU ,  Guangying ZHANG ,  Shaorong ZHOU ,  David PIDWERBECKI ,  Chuanlou WANG ,  Sandeep AHUJA ,  Mark MACDONALD ,  Sung Ki KIM ,  Xiang QUE ,  Haifeng GONG ,  Jessica GULLBRAND ,  Drew DAMM ,  Eric D. MCAFEE ,  Suchismita SARANGI

IPC: H05K7/20

CPC classification number: H05K7/20272 ,  H05K7/20236 ,  H05K7/2039 ,  H05K7/20772

Abstract: An apparatus is described that includes a flow enhancement structure to enhance a flow of immersion bath liquid specifically through space between fins of a heat sink and/or across a base of a heat sink.

公开(公告)号：US20210327787A1

公开(公告)日：2021-10-21

申请号：US17356014

申请日：2021-06-23

Applicant: Intel Corporation

Inventor： Jin YANG ,  Jimmy CHUANG ,  Xicai JING ,  Yuan-Liang LI ,  Yuyang XIA ,  David SHIA ,  Mohanraj PRABHUGOUD ,  Maria de la Luz BELMONT ,  Oscar FARIAS MOGUEL ,  Andres RAMIREZ MACIAS ,  Javier AVALOS GARCIA ,  Jessica GULLBRAND ,  Shaorong ZHOU ,  Chia-Pin CHIU ,  Xiaojin GU

IPC: H01L23/44

Abstract: An apparatus is described. The apparatus includes a packaged semiconductor device. The packaged semiconductor device having an integrated heat spreader, wherein, a boiling enhancement structure exists on the integrated heat spreader without a block mass residing between the boiling enhancement structure and the integrated heat spreader. The boiling enhancement structure has a structured non-planar surface to promote bubble nucleation in an immersion cooling system.

公开(公告)号：US20220117114A1

公开(公告)日：2022-04-14

申请号：US17556620

申请日：2021-12-20

Applicant: Intel Corporation

Inventor： Oscar FARIAS MOGUEL ,  Javier AVALOS GARCIA ,  Oscar A. DEL RIO GONZALEZ ,  Andres RAMIREZ MACIAS ,  Maria de la Luz BELMONT ,  Jessica GULLBRAND ,  Aravind MUNUKUTLA ,  Anil Kumar KURELLA ,  Samantha YATES

IPC: H05K7/20 ,  B01D57/02

Abstract: An apparatus is described. The apparatus includes a particle collector to collect particles from an electrically insulating liquid that one or more electronic devices are to be immersed within. The particle collector having an input port to receive the electrically insulating liquid. The particle collector having an output port to emit the electrically insulating liquid. The particle collector having one or more phoretic force devices. The phoretic force devices to induce phoretic forces within the particle collector that cause the particles to collect within the particle collector. A structure is also described. The structure is to be immersed in electrically insulating liquid and mimic a boiling enhancement layer of a cooling assembly of a chip package disposed on an electronic circuit board that is also immersed in the electrically insulating liquid.

公开(公告)号：US20170098594A1

公开(公告)日：2017-04-06

申请号：US15384222

申请日：2016-12-19

Applicant: Intel Corporation

Inventor： FERAS EID ,  Jessica GULLBRAND ,  Melissa A. COWAN

IPC: H01L23/467 ,  H05K1/02 ,  H01L23/498 ,  H01L21/48 ,  H01L21/683

CPC classification number: H01L23/467 ,  B05B17/0653 ,  B81C1/00238 ,  F04D33/00 ,  F15D1/008 ,  F15D1/08 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/49838 ,  H01L2221/68345 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/10378

Abstract: Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.

公开(公告)号：US20170098593A1

公开(公告)日：2017-04-06

申请号：US15384158

申请日：2016-12-19

Applicant: Intel Corporation

Inventor： Feras EID ,  Jessica GULLBRAND ,  Melissa A. COWAN

IPC: H01L23/467 ,  H05K1/18 ,  H05K1/02

CPC classification number: H01L23/467 ,  B05B17/0653 ,  B81C1/00238 ,  F04D33/00 ,  F15D1/008 ,  F15D1/08 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/49838 ,  H01L2221/68345 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/10378

Abstract: Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.

公开(公告)号：US20160358841A1

公开(公告)日：2016-12-08

申请号：US14728705

申请日：2015-06-02

Applicant: INTEL CORPORATION

Inventor： Feras EID ,  Jessica GULLBRAND ,  Melissa A. COWAN

IPC: H01L23/467 ,  B05B17/06 ,  H01L21/683 ,  H05K1/18 ,  H05K1/02 ,  H01L21/48 ,  F15D1/00 ,  H01L23/498

CPC classification number: H01L23/467 ,  B05B17/0653 ,  B81C1/00238 ,  F04D33/00 ,  F15D1/008 ,  F15D1/08 ,  H01L21/4846 ,  H01L21/6835 ,  H01L23/49838 ,  H01L2221/68345 ,  H05K1/0203 ,  H05K1/0272 ,  H05K1/181 ,  H05K2201/10378

Abstract: Embodiments include a synthetic jet device formed within layers of a package substrate, such as to provide a controlled airflow for sensing or cooling applications. The jet device includes an electromagnetically driven vibrating membrane of conductive material between a top and bottom cavity. A top lid with an opening covers the top cavity, and a permanent magnet is below the bottom cavity. An alternating current signal conducted through the membrane causes the membrane to vibrate in the presence of a magnetic field caused by the permanent magnet. By being manufactured with package forming processes, the jet (1) is manufactured more cost-effectively than by using silicon chip or wafer processing; (2) is easily integrated as part of and with the other layers of a package substrate; and (3) can be driven by a chip mounted on the package. Embodiments also include systems having and processes for forming the jet.

Abstract translation: 实施例包括形成在封装衬底的层内的合成喷射装置，以便提供用于感测或冷却应用的受控气流。 喷射装置包括在顶部和底部空腔之间的导电材料的电磁驱动振动膜。 具有开口的顶盖覆盖顶部空腔，并且永久磁铁位于底部空腔下方。 通过膜传导的交流信号导致膜在由永磁体引起的磁场的存在下振动。 通过用封装成形工艺制造，与使用硅芯片或晶片加工相比，射流（1）的成本更高， （2）容易地集成为封装衬底的其他层的一部分并与其一起; 和（3）可以由安装在包装上的芯片驱动。 实施例还包括具有用于形成射流的方法和方法。