公开(公告)号：US09893023B2

公开(公告)日：2018-02-13

申请号：US15606178

申请日：2017-05-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Edward C. Cooney, III ,  Fen Chen ,  Jonathan M. Pratt ,  Jason P. Ritter ,  Patrick S. Spinney ,  Anna Tilley

IPC: H01L21/76 ,  H01L21/768 ,  H01L23/00 ,  H01L23/522

CPC classification number: H01L23/573 ,  H01L21/76895 ,  H01L23/5226 ,  H01L2224/11

Abstract: A structure and a method. The structure includes a semiconductor substrate; a stack of wiring levels from a first wiring level to a last wiring level, the first wiring level closest to the semiconductor substrate and the last wiring level furthest from the semiconductor substrate, the stack of wiring levels including an intermediate wiring level between the first wiring level and the last wiring level; active devices contained in the semiconductor substrate and the first wiring level, each wiring level of the stack of wiring levels comprising a dielectric layer containing electrically conductive wire; a trench extending from the intermediate wiring level, through the first wiring level into the semiconductor substrate; and a chemical agent filling the trench, portions of at least one wiring level of the stack of wiring levels not chemically inert to the chemical agent or a reaction product of the chemical agent.

公开(公告)号：US20180053734A1

公开(公告)日：2018-02-22

申请号：US15798598

申请日：2017-10-31

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Edward C. Cooney, III ,  Fen Chen ,  Jonathan M. Pratt ,  Jason P. Ritter ,  Patrick S. Spinney ,  Anna Tilley

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/522

CPC classification number: H01L23/573 ,  H01L21/76895 ,  H01L23/5226 ,  H01L2224/11

Abstract: A structure and a method. The structure includes a semiconductor substrate; a stack of wiring levels from a first wiring level to a last wiring level, the first wiring level closest to the semiconductor substrate and the last wiring level furthest from the semiconductor substrate, the stack of wiring levels including an intermediate wiring level between the first wiring level and the last wiring level; active devices contained in the semiconductor substrate and the first wiring level, each wiring level of the stack of wiring levels comprising a dielectric layer containing electrically conductive wire; a trench extending from the intermediate wiring level, through the first wiring level into the semiconductor substrate; and a chemical agent filling the trench, portions of at least one wiring level of the stack of wiring levels not chemically inert to the chemical agent or a reaction product of the chemical agent.

公开(公告)号：US10141274B2

公开(公告)日：2018-11-27

申请号：US15798598

申请日：2017-10-31

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Edward C. Cooney, III ,  Fen Chen ,  Jonathan M. Pratt ,  Jason P. Ritter ,  Patrick S. Spinney ,  Anna Tilley

IPC: H01L23/522 ,  H01L23/00 ,  H01L21/768

Abstract: A structure and a method. The structure includes a semiconductor substrate; a stack of wiring levels from a first wiring level to a last wiring level, the first wiring level closest to the semiconductor substrate and the last wiring level furthest from the semiconductor substrate, the stack of wiring levels including an intermediate wiring level between the first wiring level and the last wiring level; active devices contained in the semiconductor substrate and the first wiring level, each wiring level of the stack of wiring levels comprising a dielectric layer containing electrically conductive wire; a trench extending from the intermediate wiring level, through the first wiring level into the semiconductor substrate; and a chemical agent filling the trench, portions of at least one wiring level of the stack of wiring levels not chemically inert to the chemical agent or a reaction product of the chemical agent.

公开(公告)号：US20170263574A1

公开(公告)日：2017-09-14

申请号：US15606178

申请日：2017-05-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Edward C. Cooney, III ,  Fen Chen ,  Jonathan M. Pratt ,  Jason P. Ritter ,  Patrick S. Spinney ,  Anna Tilley

IPC: H01L23/00 ,  H01L23/522 ,  H01L21/768

CPC classification number: H01L23/573 ,  H01L21/76895 ,  H01L23/5226 ,  H01L2224/11

Abstract: A structure and a method. The structure includes a semiconductor substrate; a stack of wiring levels from a first wiring level to a last wiring level, the first wiring level closest to the semiconductor substrate and the last wiring level furthest from the semiconductor substrate, the stack of wiring levels including an intermediate wiring level between the first wiring level and the last wiring level; active devices contained in the semiconductor substrate and the first wiring level, each wiring level of the stack of wiring levels comprising a dielectric layer containing electrically conductive wire; a trench extending from the intermediate wiring level, through the first wiring level into the semiconductor substrate; and a chemical agent filling the trench, portions of at least one wiring level of the stack of wiring levels not chemically inert to the chemical agent or a reaction product of the chemical agent.

公开(公告)号：US09711464B2

公开(公告)日：2017-07-18

申请号：US14862700

申请日：2015-09-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Edward C. Cooney, III ,  Fen Chen ,  Jonathan M. Pratt ,  Jason P. Ritter ,  Patrick S. Spinney ,  Anna Tilley

IPC: H01L23/532 ,  H01L23/00 ,  H01L23/522 ,  H01L21/768

CPC classification number: H01L23/573 ,  H01L21/76895 ,  H01L23/5226 ,  H01L2224/11

Abstract: A structure and a method. The structure includes a semiconductor substrate; a stack of wiring levels from a first wiring level to a last wiring level, the first wiring level closest to the semiconductor substrate and the last wiring level furthest from the semiconductor substrate, the stack of wiring levels including an intermediate wiring level between the first wiring level and the last wiring level; active devices contained in the semiconductor substrate and the first wiring level, each wiring level of the stack of wiring levels comprising a dielectric layer containing electrically conductive wire; a trench extending from the intermediate wiring level, through the first wiring level into the semiconductor substrate; and a chemical agent filling the trench, portions of at least one wiring level of the stack of wiring levels not chemically inert to the chemical agent or a reaction product of the chemical agent.

公开(公告)号：US20170084552A1

公开(公告)日：2017-03-23

申请号：US14862700

申请日：2015-09-23

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Edward C. Cooney, III ,  Fen Chen ,  Jonathan M. Pratt ,  Jason P. Ritter ,  Patrick S. Spinney ,  Anna Tilley

IPC: H01L23/00 ,  H01L21/768 ,  H01L23/522

CPC classification number: H01L23/573 ,  H01L21/76895 ,  H01L23/5226 ,  H01L2224/11

Abstract: A structure and a method. The structure includes a semiconductor substrate; a stack of wiring levels from a first wiring level to a last wiring level, the first wiring level closest to the semiconductor substrate and the last wiring level furthest from the semiconductor substrate, the stack of wiring levels including an intermediate wiring level between the first wiring level and the last wiring level; active devices contained in the semiconductor substrate and the first wiring level, each wiring level of the stack of wiring levels comprising a dielectric layer containing electrically conductive wire; a trench extending from the intermediate wiring level, through the first wiring level into the semiconductor substrate; and a chemical agent filling the trench, portions of at least one wiring level of the stack of wiring levels not chemically inert to the chemical agent or a reaction product of the chemical agent.

公开(公告)号：US20150267084A1

公开(公告)日：2015-09-24

申请号：US14733235

申请日：2015-06-08

Applicant: International Business Machines Corporation

Inventor： Graham M. Bates ,  Michael T. Brigham ,  Joseph K. Comeau ,  Jason P. Ritter ,  Matthew T. Tiersch ,  Eva A. Shah ,  Eric J. White

IPC: C09G1/04

CPC classification number: C09G1/04 ,  C09G1/02 ,  C09K3/1463 ,  C09K3/1472 ,  C11D11/0047 ,  H01L21/3212 ,  H01L21/7684

Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.

Abstract translation: 化学机械抛光的组合物和方法。 组合物包括表面活性剂阴离子烷基醇和稀释剂。 组合物还包括研磨颗粒和氧化剂。 该方法包括在要抛光的表面上提供该组合物，并通过使该表面与抛光垫接触来抛光该表面。