MULTIMODE RESONATORS FOR RESONATOR INDUCED PHASE GATES

    公开(公告)号:US20220180235A1

    公开(公告)日:2022-06-09

    申请号:US17111053

    申请日:2020-12-03

    Abstract: Techniques regarding qubit coupling structures that enable RIP gates are provided. For example, one or more embodiments described herein can comprise an apparatus that can include a coupling structure coupled to a first qubit and a second qubit. The coupling structure can have a plurality of coupling pathways. A coupling pathway from the plurality of coupling pathways can be a resonator. Also, the first qubit can be coupled to a first end of the resonator, and the second qubit can be coupled to a point along a length of the resonator.

    Architecture for coupling quantum bits using localized resonators

    公开(公告)号:US10283696B2

    公开(公告)日:2019-05-07

    申请号:US14949248

    申请日:2015-11-23

    Abstract: A technique relates a superconducting microwave cavity. An array of posts has different heights in the cavity, and the array supports a localized microwave mode. The array of posts includes lower resonant frequency posts and higher resonant frequency posts. The higher resonant frequency posts are arranged around the lower resonant frequency posts. A first plate is opposite a second plate in the cavity. One end of the lower resonant frequency posts is positioned on the second plate so as to be electrically connected to the second plate. Another end of the lower resonant frequency posts in the array is open so as not to form an electrical connection to the first plate. Qubits are connected to the lower resonant frequency posts in the array of posts, such that each of the qubits is physically connected to one or two of the lower resonant frequency posts in the array of posts.

    Multimode resonators for resonator induced phase gates

    公开(公告)号:US11972319B2

    公开(公告)日:2024-04-30

    申请号:US17111053

    申请日:2020-12-03

    CPC classification number: G06N10/00 G06N10/40

    Abstract: Techniques regarding qubit coupling structures that enable RIP gates are provided. For example, one or more embodiments described herein can comprise an apparatus that can include a coupling structure coupled to a first qubit and a second qubit. The coupling structure can have a plurality of coupling pathways. A coupling pathway from the plurality of coupling pathways can be a resonator. Also, the first qubit can be coupled to a first end of the resonator, and the second qubit can be coupled to a point along a length of the resonator.

    Strategic pausing for quantum state leakage mitigation

    公开(公告)号:US11960970B2

    公开(公告)日:2024-04-16

    申请号:US17096170

    申请日:2020-11-12

    CPC classification number: G06N10/00 G01R31/52

    Abstract: Systems and techniques that facilitate strategic pausing for quantum state leakage mitigation are provided. In various embodiments, a system can comprise a detection component that can detect a quantum state leakage associated with one or more qubits. In various aspects, the system can further comprise a pause component that can, in response to detecting the quantum state leakage, generate a time pause prior to execution of a quantum circuit on the one or more qubits. In various embodiments, the pause component can generate the time pause after execution of a previous quantum circuit on the one or more qubits, where the quantum state leakage arises during the execution of the previous quantum circuit. In some cases, the quantum state leakage can decay during the time pause.

    Architecture for coupling quantum bits using localized resonators

    公开(公告)号:US10529909B2

    公开(公告)日:2020-01-07

    申请号:US15945281

    申请日:2018-04-04

    Abstract: A technique relates a superconducting microwave cavity. An array of posts has different heights in the cavity, and the array supports a localized microwave mode. The array of posts includes lower resonant frequency posts and higher resonant frequency posts. The higher resonant frequency posts are arranged around the lower resonant frequency posts. A first plate is opposite a second plate in the cavity. One end of the lower resonant frequency posts is positioned on the second plate so as to be electrically connected to the second plate. Another end of the lower resonant frequency posts in the array is open so as not to form an electrical connection to the first plate. Qubits are connected to the lower resonant frequency posts in the array of posts, such that each of the qubits is physically connected to one or two of the lower resonant frequency posts in the array of posts.

    ARCHITECTURE FOR COUPLING QUANTUM BITS USING LOCALIZED RESONATORS

    公开(公告)号:US20170005255A1

    公开(公告)日:2017-01-05

    申请号:US14755181

    申请日:2015-06-30

    CPC classification number: H01L39/24 B82Y10/00 G06N99/002 H01L39/14

    Abstract: A technique relates a superconducting microwave cavity. An array of posts has different heights in the cavity, and the array supports a localized microwave mode. The array of posts includes lower resonant frequency posts and higher resonant frequency posts. The higher resonant frequency posts are arranged around the lower resonant frequency posts. A first plate is opposite a second plate in the cavity. One end of the lower resonant frequency posts is positioned on the second plate so as to be electrically connected to the second plate. Another end of the lower resonant frequency posts in the array is open so as not to form an electrical connection to the first plate. Qubits are connected to the lower resonant frequency posts in the array of posts, such that each of the qubits is physically connected to one or two of the lower resonant frequency posts in the array of posts.

    Edge capacitive coupling for quantum chips

    公开(公告)号:US12249748B2

    公开(公告)日:2025-03-11

    申请号:US17935023

    申请日:2022-09-23

    Abstract: A quantum computing chip device provides an edge based capacitive, intra-chip connection. A first chip includes a first signal line with a distal end positioned proximate to or on an edge of the first chip and a proximal end positioned away from the edge of the first chip. A second chip includes a second signal line with a distal end positioned proximate to or on an edge of the second chip and a proximal end positioned away from the edge of the second chip. The first signal line and the second signal line are configured to conduct a signal. The second signal line of the second chip is disposed in alignment for a capacitive bus connection to the first signal line of the first chip.

    EDGE CAPACITIVE COUPLING FOR QUANTUM CHIPS
    10.
    发明公开

    公开(公告)号:US20240104414A1

    公开(公告)日:2024-03-28

    申请号:US17935023

    申请日:2022-09-23

    CPC classification number: G06N10/40 H01R12/721 H02J50/05

    Abstract: A quantum computing chip device provides an edge based capacitive, intra-chip connection. A first chip includes a first signal line with a distal end positioned proximate to or on an edge of the first chip and a proximal end positioned away from the edge of the first chip. A second chip includes a second signal line with a distal end positioned proximate to or on an edge of the second chip and a proximal end positioned away from the edge of the second chip. The first signal line and the second signal line are configured to conduct a signal. The second signal line of the second chip is disposed in alignment for a capacitive bus connection to the first signal line of the first chip.

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