公开(公告)号：US20210111472A1

公开(公告)日：2021-04-15

申请号：US16600760

申请日：2019-10-14

Applicant: International Business Machines Corporation

Inventor： JOSHUA C. MYERS ,  JOSE A. HEJASE ,  JUNYAN TANG ,  PAVEL ROY PALADHI ,  WIREN D. BECKER ,  SUNGJUN CHUN ,  DANIEL M. DREPS

IPC: H01P3/12 ,  H05K1/11 ,  H05K1/02

Abstract: Methods and apparatuses for vertically transitioning signals between substrate integrated waveguides within a multilayered printed circuit board (PCB) are disclosed. A first substrate integrated waveguide (SIW) is provided in a first layer of the PCB, the first SIW having a first terminal portion. A second SIW is provided in a second layer of the PCB, the second SIW having a second terminal portion that overlaps with the first terminal portion, wherein a first ground plane separates the first SIW and the second SIW. A vertical transition comprising an aperture in the first ground plane that is disposed in an area defined by the overlap of the first terminal portion and the second terminal portion, such that a signal propagated in the first SIW transitions to the second SIW in a different layer through the aperture.

公开(公告)号：US20240321802A1

公开(公告)日：2024-09-26

申请号：US18187180

申请日：2023-03-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： JUNYAN TANG ,  SUNGJUN CHUN ,  DANIEL MARK DREPS ,  WIREN DALE BECKER ,  JOSE A HEJASE ,  PAVEL ROY PALADHI ,  NAM HUU PHAM

IPC: H01L23/00 ,  H01L23/48 ,  H01L23/498 ,  H01L23/50

CPC classification number: H01L24/20 ,  H01L23/481 ,  H01L23/49827 ,  H01L23/50 ,  H01L24/45 ,  H01L24/85 ,  H01L2924/1432

Abstract: An integrated circuit and a cable interconnect interface are disposed on a substrate and in communication with one another. The cable interconnect interface includes a first plurality of connector pads arranged in a first column and a second plurality of connector pads arranged in a second column. A radio frequency absorption layer is disposed on one or more of the first plurality of connector pads and the second plurality of connector pads. The first plurality of connector pads includes a first group of transmission connector pads and a first group of receiving connector pads. The second plurality of connector pads includes a second group of transmission connector pads and a second group of receiving connector pads. The first group of transmission connector pads is opposite the second group of transmission connector pads, and the first group of receiving connector pads is opposite the second group of receiving connector pads.