公开(公告)号：US09599657B2

公开(公告)日：2017-03-21

申请号：US13733507

申请日：2013-01-03

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Hanyi Ding ,  John Ferrario ,  Barton E. Green ,  Stephen Moss ,  Mustapha Slamani

IPC: G01R31/20 ,  G01R31/26 ,  G01R1/067

CPC classification number: G01R31/26 ,  G01R1/06766 ,  G01R1/06772

Abstract: Approaches for performing in line wafer testing are provided. An approach includes a method that includes generating a radio frequency (RF) test signal, and applying the RF test signal to a device under test (DUT) in a wafer using a buckling beam probe set with a predefined pitch. The method also includes detecting an output RF signal from the DUT in response to the applying the RF test signal to the DUT, and sensing at least one frequency component of the detected output RF signal.