公开(公告)号：US09956646B2

公开(公告)日：2018-05-01

申请号：US14633912

申请日：2015-02-27

申请人： IPG Photonics Corporation

发明人： Marco Mendes ,  Jeffrey P. Sercel ,  Rouzbeh Sarrafi ,  Xiangyang Song ,  Joshua Schoenly ,  Roy Van Gemert ,  Cristian Porneala

IPC分类号： B23K26/06 ,  B23K26/00 ,  B23K103/12

CPC分类号： B23K26/0006 ,  B23K26/0604 ,  B23K2103/12

摘要： Multiple-beam laser processing may be performed on a workpiece using at least first and second laser beams with different characteristics (e.g., wavelengths and/or pulse durations). In some applications, an assist laser beam is directed at a target location on or within the workpiece to modify a property of the non-absorptive material. A process laser beam is directed at the target location and is coupled into absorption centers formed in the non-absorptive material to complete processing of the non-absorptive material. Multiple-beam laser processing may be used, for example, to drill holes in a substrate made of alumina or other transparent ceramics. In other applications, multiple-beam laser processing may be used in melting applications such as micro-welding, soldering, and forming laser fired contacts. In these applications, the assist laser beam may be used to modify a property of the material or to change the geometry of the parts.

公开(公告)号：US20150246412A1

公开(公告)日：2015-09-03

申请号：US14633912

申请日：2015-02-27

申请人： IPG Photonics Corporation

发明人： Marco Mendes ,  Jeffrey P. Sercel ,  Rouzbeh Sarrafi ,  Xiangyang Song ,  Joshua Schoenly ,  Roy Van Gemert ,  Cristian Porneala

IPC分类号： B23K26/00 ,  B23K26/38

CPC分类号： B23K26/0006 ,  B23K26/0604 ,  B23K2103/12

摘要： Multiple-beam laser processing may be performed on a workpiece using at least first and second laser beams with different characteristics (e.g., wavelengths and/or pulse durations). In some applications, an assist laser beam is directed at a target location on or within the workpiece to modify a property of the non-absorptive material. A process laser beam is directed at the target location and is coupled into absorption centers formed in the non-absorptive material to complete processing of the non-absorptive material. Multiple-beam laser processing may be used, for example, to drill holes in a substrate made of alumina or other transparent ceramics. In other applications, multiple-beam laser processing may be used in melting applications such as micro-welding, soldering, and forming laser fired contacts. In these applications, the assist laser beam may be used to modify a property of the material or to change the geometry of the parts.

摘要翻译： 可以使用至少具有不同特性（例如波长和/或脉冲持续时间）的第一和第二激光束在工件上执行多光束激光处理。 在一些应用中，辅助激光束被引导到工件上或工件内的目标位置，以改变非吸收材料的性质。 过程激光束被引导到目标位置，并且耦合到形成在非吸收材料中的吸收中心，以完成非吸收材料的处理。 可以使用多光束激光加工，例如在由氧化铝或其它透明陶瓷制成的基板中钻孔。 在其他应用中，多光束激光加工可用于熔化应用，例如微焊接，焊接和形成激光烧结接触。 在这些应用中，辅助激光束可用于改变材料的性质或改变部件的几何形状。