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    Laser apparatus and method of processing thin films
    1.
    发明授权
    Laser apparatus and method of processing thin films 有权

    公开(公告)号：US11600491B2

    公开(公告)日：2023-03-07

    申请号：US16635097

    申请日：2018-07-31

    申请人： IPG PHOTONICS CORPORATION

    发明人： Limanov Alexander ,  Michael Von Dadelszen ,  Joshua Schoenly ,  Manuel Leonardo

    IPC分类号： H01L21/02 ,  B23K26/0622 ,  H01L21/67 ,  H01L27/12 ,  B23K26/064 ,  B23K26/073 ,  B23K26/066 ,  B23K103/00

    摘要： A method of fiber laser processing of thin film deposited on a substrate includes providing a laser beam from at least one fiber laser which is guided through a beam-shaping unit onto the thin film. The beam-shaping optics is configured to shape the laser beam into a line beam which irradiates a first irradiated thin film area Ab on a surface of the thin film, with the irradiated thin film area Ab being a fraction of the thin film area Af. By continuously displacing the beam shaping optics and the film relative to one another in a first direction at a distance dy between sequential irradiations, a sequence of uniform irradiated thin film areas Ab are formed on the film surface defining thus a first elongated column. Thereafter the beam shaped optics and film are displaced relative to one another at a distance dx in a second direction transverse to the first direction with the distance dx being smaller than a length of the irradiated film area Ab. With the steps performed to form respective columns, the elongated columns overlap one another covering the desired thin film area Af. The dx and dy distances are so selected that that each location of the film area Af is exposed to the shaped laser beam during a cumulative predetermined duration.

    System and method for laser beveling and/or polishing
    2.
    发明授权
    System and method for laser beveling and/or polishing 有权

    公开(公告)号：US10343237B2

    公开(公告)日：2019-07-09

    申请号：US14838837

    申请日：2015-08-28

    申请人： IPG Photonics Corporation

    发明人： Jeffrey P. Sercel ,  Marco Mendes ,  Rouzbeh Sarrafi ,  Joshua Schoenly ,  Xiangyang Song ,  Mathew Hannon ,  Miroslaw Sokol

    IPC分类号： B29C67/00 ,  B23K26/361 ,  B23K26/402 ,  B23K26/08 ,  B23K26/38 ,  B23K103/00

    摘要： Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

    SYSTEM AND METHOD FOR LASER BEVELING AND/OR POLISHING
    3.
    发明申请
    SYSTEM AND METHOD FOR LASER BEVELING AND/OR POLISHING 审中-公开

    公开(公告)号：US20190314934A1

    公开(公告)日：2019-10-17

    申请号：US16422558

    申请日：2019-05-24

    申请人： IPG Photonics Corporation

    发明人： Jeffrey P. Sercel ,  Marco Mendes ,  Rouzbeh Sarrafi ,  Joshua Schoenly ,  Xiangyang Song ,  Mathew Hannon ,  Miroslaw Sokol

    IPC分类号： B23K26/361 ,  B23K26/38 ,  B23K26/402 ,  B23K26/08

    摘要： Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

    System and method for laser beveling and/or polishing
    5.
    发明授权
    System and method for laser beveling and/or polishing 有权

    公开(公告)号：US11565350B2

    公开(公告)日：2023-01-31

    申请号：US16422558

    申请日：2019-05-24

    申请人： IPG Photonics Corporation

    发明人： Jeffrey P. Sercel ,  Marco Mendes ,  Rouzbeh Sarrafi ,  Joshua Schoenly ,  Xiangyang Song ,  Mathew Hannon ,  Miroslaw Sokol

    IPC分类号： B23K26/361 ,  B23K26/08 ,  B23K26/38 ,  B23K26/402 ,  B23K103/00

    摘要： Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

    MULTIPLE-BEAM LASER PROCESSING USING MULTIPLE LASER BEAMS WITH DISTINCT WAVELENGTHS AND/OR PULSE DURATIONS
    9.
    发明申请
    MULTIPLE-BEAM LASER PROCESSING USING MULTIPLE LASER BEAMS WITH DISTINCT WAVELENGTHS AND/OR PULSE DURATIONS 有权
    多波束激光加工使用多个激光波长和/或脉冲持续时间

    公开(公告)号：US20150246412A1

    公开(公告)日：2015-09-03

    申请号：US14633912

    申请日：2015-02-27

    申请人： IPG Photonics Corporation

    发明人： Marco Mendes ,  Jeffrey P. Sercel ,  Rouzbeh Sarrafi ,  Xiangyang Song ,  Joshua Schoenly ,  Roy Van Gemert ,  Cristian Porneala

    IPC分类号： B23K26/00 ,  B23K26/38

    CPC分类号： B23K26/0006 ,  B23K26/0604 ,  B23K2103/12

    摘要： Multiple-beam laser processing may be performed on a workpiece using at least first and second laser beams with different characteristics (e.g., wavelengths and/or pulse durations). In some applications, an assist laser beam is directed at a target location on or within the workpiece to modify a property of the non-absorptive material. A process laser beam is directed at the target location and is coupled into absorption centers formed in the non-absorptive material to complete processing of the non-absorptive material. Multiple-beam laser processing may be used, for example, to drill holes in a substrate made of alumina or other transparent ceramics. In other applications, multiple-beam laser processing may be used in melting applications such as micro-welding, soldering, and forming laser fired contacts. In these applications, the assist laser beam may be used to modify a property of the material or to change the geometry of the parts.

    摘要翻译： 可以使用至少具有不同特性（例如波长和/或脉冲持续时间）的第一和第二激光束在工件上执行多光束激光处理。 在一些应用中，辅助激光束被引导到工件上或工件内的目标位置，以改变非吸收材料的性质。 过程激光束被引导到目标位置，并且耦合到形成在非吸收材料中的吸收中心，以完成非吸收材料的处理。 可以使用多光束激光加工，例如在由氧化铝或其它透明陶瓷制成的基板中钻孔。 在其他应用中，多光束激光加工可用于熔化应用，例如微焊接，焊接和形成激光烧结接触。 在这些应用中，辅助激光束可用于改变材料的性质或改变部件的几何形状。