IMPROVED STRUCTURAL ADHESIVE MATERIALS
    2.
    发明申请
    IMPROVED STRUCTURAL ADHESIVE MATERIALS 有权
    改进的结构胶粘材料

    公开(公告)号:US20100276645A1

    公开(公告)日:2010-11-04

    申请号:US12601826

    申请日:2008-06-02

    Abstract: An adhesive material comprising at least one adhesive polymeric resin, at least one low aspect ratio metal-coated additive, and at least one high aspect ratio metal-coated additive. There is additionally provided an adhesive material comprising at least one adhesive polymeric resin, and one of either; a) low aspect ratio metal-coated additives present in the range 0.2 wt. % to 30 wt. % of the adhesive material; or b) discrete high aspect ratio metal-coated additives present in the range 0.2 wt. % to 25 wt. % of the adhesive material.

    Abstract translation: 一种粘合剂材料,其包含至少一种粘合性聚合物树脂,至少一种低纵横比金属涂覆的添加剂和至少一种高纵横比金属涂覆的添加剂。 还提供了一种粘合剂材料,其包括至少一种粘合性聚合物树脂,并且其中之一之一; a)低范围比的金属涂层添加剂,其范围为0.2wt。 %〜30重量% %的粘合剂材料; 或b)离散的高纵横比金属涂层添加剂,其范围为0.2wt。 %至25wt。 %的粘合剂材料。

    Low Temperature Curing Of Toughened Adhesives
    3.
    发明申请
    Low Temperature Curing Of Toughened Adhesives 审中-公开
    增韧粘合剂的低温固化

    公开(公告)号:US20100108259A1

    公开(公告)日:2010-05-06

    申请号:US12522423

    申请日:2007-01-17

    Applicant: Ian Aspin

    Inventor: Ian Aspin

    Abstract: Surfaces are bonded together using a thermoplastic toughened epoxy adhesive wherein the adhesive contains an epoxy component, a thermoplastic component, a core/shell particle component and a curing agent. The thermoplastic toughened epoxy adhesive is only heated during bonding to a relatively low curing temperature of between 140° C. and 160° C. for a sufficient time to cure the adhesive and provide surfaces that are bonded together with a high-strength bond.

    Abstract translation: 表面使用热塑性增韧环氧粘合剂粘合在一起,其中粘合剂含有环氧组分,热塑性组分,核/壳颗粒组分和固化剂。 热塑性增韧环氧树脂粘合剂仅在粘合期间加热至140℃至160℃之间的相对低的固化温度足够长的时间来固化粘合剂并提供用高强度粘合剂结合在一起的表面。

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