公开(公告)号：US09130133B2

公开(公告)日：2015-09-08

申请号：US13421337

申请日：2012-03-15

Applicant: In-joon Pyeon

Inventor： In-joon Pyeon

IPC: H01L33/00 ,  H01L33/52 ,  H01L23/00

CPC classification number: H01L33/52 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light-emitting device package and method of manufacturing the same. The method includes: preparing a package main body comprising a plurality of cavities, wherein a light-emitting device chip is mounted in each of the cavities and a through hole is formed in a bottom of each of the cavities; preparing a fixed mold providing a first surface that blocks the cavity; coupling the package main body to the fixed mold such that an end portion of the cavity contacts the first surface; supplying an encapsulation material into the cavity through the through hole; hardening the encapsulation material; and separating the package main body from the fixed mold, and dicing the package main body into a plurality of light-emitting device packages using a singulation operation. The encapsulation material is supplied while disposing the package main body on the fixed mold so that the encapsulation material is supplied in a gravitational direction.

Abstract translation: 发光器件封装及其制造方法。 该方法包括：制备包括多个空腔的封装主体，其中在每个空腔中安装发光器件芯片，并且在每个空腔的底部形成通孔; 制备固定模具，提供阻挡空腔的第一表面; 将包装主体联接到固定模具，使得空腔的端部接触第一表面; 通过所述通孔将封装材料供应到所述空腔中; 硬化封装材料; 以及将所述包装主体与所述固定模具分离，并且使用单独操作将所述包装主体切割成多个发光装置包装。 在将包装主体设置在固定模具上的同时供给封装材料，使得封装材料在重力方向上被供应。