FLEXIBLE CHIP PACKAGE
    1.
    发明申请

    公开(公告)号:US20190103360A1

    公开(公告)日:2019-04-04

    申请号:US15919222

    申请日:2018-03-13

    Abstract: A flexible chip package is provided. The flexible chip package includes a first flexible substrate; a first redistribution layer disposed on the first flexible substrate; a second flexible substrate; a second redistribution layer disposed on the second flexible substrate; a semiconductor chip disposed between the first and second redistribution layers and electrically connected to at least one of the first and second redistribution layers; and a first bonding layer disposed between the first and second redistribution layers and encapsulating the semiconductor chip, wherein the first bonding layer, the first redistribution layer and the second redistribution layer are between the first flexible substrate and the second flexible substrate.

Patent Agency Ranking