公开(公告)号：US20180149525A1

公开(公告)日：2018-05-31

申请号：US15573568

申请日：2016-05-13

申请人： INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY

发明人： Sang Won YOON ,  Min Ki KIM

IPC分类号： G01K5/56 ,  G01L1/16

CPC分类号： G01K5/56 ,  G01K5/72 ,  G01L1/16 ,  H01L41/0805 ,  H01L41/1132 ,  H01L41/257

摘要： An apparatus for measuring a temperature of a power device using a piezoelectric device according to an exemplary embodiment of the present disclosure includes: a substrate; at least one power device formed on one surface of the substrate; and at least one piezoelectric device disposed on the substrate as spaced from the power device and configured to measure a thermal stress generated on the substrate to sense a temperature caused by heat generation of the power device.

公开(公告)号：US20180294209A1

公开(公告)日：2018-10-11

申请号：US15573955

申请日：2016-05-13

申请人： Industry-University Cooperation Foundation Hanyang University

发明人： Sang Won YOON

IPC分类号： H01L23/48 ,  H01L21/768 ,  H01L21/3065 ,  H01L21/683 ,  H01L21/02

CPC分类号： H01L23/481 ,  G01D11/26 ,  H01L21/02118 ,  H01L21/3065 ,  H01L21/3212 ,  H01L21/6835 ,  H01L21/76831 ,  H01L21/7684 ,  H01L21/76871 ,  H01L21/76877 ,  H01L21/76898 ,  H01L23/00 ,  H01L23/48 ,  H01L2221/68359

摘要： A method for manufacturing a sensor packaging according to an exemplary embodiment of the present disclosure includes: forming a via hole penetrating a main substrate by etching each of both surfaces of the main substrate; forming an insulating layer on a wall surface of the via hole and the both surfaces of the main substrate; combining a sub-substrate on which a metallic seed layer and a bonding layer having a pattern for exposing a part of the seed layer are laminated with the main substrate; forming a filling layer configured to cover an upper surface of the main substrate by filling metal in the via hole; and removing the sub-substrate from the main substrate.