公开(公告)号：US20180211907A1

公开(公告)日：2018-07-26

申请号：US15412108

申请日：2017-01-23

Applicant: Infineon Technologies AG

Inventor： Mohd Kahar Bajuri ,  Edmund Sales Cabatbat ,  Gaylord Evangelista Cruz ,  Amirul Afiq Hud ,  Teck Sim Lee ,  Norbert Joson Santos ,  Chiew Li Tai ,  Chin Wei Yang

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L21/4853 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower surface, the heat slug being attached to the peripheral structure. A semiconductor die is attached to the heat slug. The semiconductor die is encapsulated with a molding compound while the heat slug is attached to the peripheral structure. The heat slug is completely devoid of fasteners before the encapsulating.

公开(公告)号：US10083899B2

公开(公告)日：2018-09-25

申请号：US15412108

申请日：2017-01-23

Applicant: Infineon Technologies AG

Inventor： Mohd Kahar Bajuri ,  Edmund Sales Cabatbat ,  Gaylord Evangelista Cruz ,  Amirul Afiq Hud ,  Teck Sim Lee ,  Norbert Joson Santos ,  Chiew Li Tai ,  Chin Wei Yang

IPC: H01L23/40 ,  H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49568 ,  H01L21/4853 ,  H01L21/4882 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/4334 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A method of forming a semiconductor device package includes providing a lead frame having a peripheral structure and a heat slug having an upper and lower surface, the heat slug being attached to the peripheral structure. A semiconductor die is attached to the heat slug. The semiconductor die is encapsulated with a molding compound while the heat slug is attached to the peripheral structure. The heat slug is completely devoid of fasteners before the encapsulating.