公开(公告)号：US20170011989A1

公开(公告)日：2017-01-12

申请号：US14792908

申请日：2015-07-07

Applicant: Infineon Technologies AG

Inventor： Chip King Tan ,  Chan Lam Cha

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L24/85 ,  H01L21/4825 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49513 ,  H01L24/00 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A lead frame includes a die paddle, a first lead, and a U-notch coupling the die paddle to the first lead. The U-notch extends from the die paddle and the first lead. The U-notch is configured to be removed to electrically isolate the first lead from the die paddle.

Abstract translation: 引线框架包括管芯焊盘，第一引线和将管芯焊盘连接到第一引线的U形凹口。 U形凹口从模片和第一导线延伸。 U形槽被配置为被去除以将第一引线与管芯焊盘电隔离。