公开(公告)号：US10793419B2

公开(公告)日：2020-10-06

申请号：US16270315

申请日：2019-02-07

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Niccolo De Milleri ,  Bernd Goller ,  Ulrich Krumbein ,  Gerhard Lohninger ,  Giordano Tosolini ,  Andreas Wiesbauer

IPC: B81B7/00 ,  H04R1/02 ,  H04R19/00 ,  H04R19/04

Abstract: A MEMS assembly includes a housing having an internal volume V, wherein the housing has a sound opening to the internal volume V, a MEMS component in the housing adjacent to the sound opening, and a layer element arranged at least regionally at a surface region of the housing that faces the internal volume V, wherein the layer element includes a layer material having a lower thermal conductivity and a higher heat capacity than the housing material of the housing that adjoins the layer element.

公开(公告)号：US20190270637A1

公开(公告)日：2019-09-05

申请号：US16270315

申请日：2019-02-07

Applicant: Infineon Technologies AG

Inventor： Marc Fueldner ,  Niccolo De Milleri ,  Bernd Goller ,  Ulrich Krumbein ,  Gerhard Lohninger ,  Giordano Tosolini ,  Andreas Wiesbauer

IPC: B81B7/00 ,  H04R1/02

Abstract: A MEMS assembly includes a housing having an internal volume V, wherein the housing has a sound opening to the internal volume V, a MEMS component in the housing adjacent to the sound opening, and a layer element arranged at least regionally at a surface region of the housing that faces the internal volume V, wherein the layer element includes a layer material having a lower thermal conductivity and a higher heat capacity than the housing material of the housing that adjoins the layer element.

公开(公告)号：US20150333395A1

公开(公告)日：2015-11-19

申请号：US14807417

申请日：2015-07-23

Applicant: Infineon Technologies AG

Inventor： Gerhard Lohninger ,  Johann P. Forstner ,  Rudolf Lachner

IPC: H01Q1/40

CPC classification number: H01Q1/40 ,  G01S7/03 ,  H01L2224/48091 ,  H01Q1/38 ,  H01Q9/285 ,  H01Q23/00 ,  Y10T29/49016 ,  H01L2924/00014

Abstract: Electronic apparatus having an antenna chip with a substrate and an antenna structure, and a method of producing the same. The antenna chip is integrated or packaged in a package having a chip mounting surface for mounting the antenna chip, and an encapsulating material. The encapsulating material typically is a plastic mold used in the industrial packaging of integrated circuits. Between the antenna structure and the chip mounting surface, a first void is disposed in the substrate.

Abstract translation: 具有带基板的天线芯片和天线结构的电子设备及其制造方法。 天线芯片集成或封装在具有用于安装天线芯片的芯片安装表面的封装和封装材料中。 封装材料通常是用于集成电路工业封装的塑料模具。 在天线结构和芯片安装表面之间，在基板中设置第一空隙。